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2020-06-04 | Document No.: AN149
Figure 18: Recommended pick-and-place nozzle from ASM SIPLACE
Solder pad design
Since the solder pad effectively creates the direct contact between the LED and
the circuit board, the design of the solder pad contributes decisively to the
performance of the solder connection. The design has an influence on solder
joint reliability and heat dissipation, for example. In most cases, it is therefore
advantageous to use the recommended solder pad, since it is individually
adapted to the properties and conditions of the LED (Figure 19). The
corresponding solder pad can also be found in the data sheet of each LED.
Figure 19: Recommended solder pad design
Based on the given solder pad design, an optimized balance between good
processability, the smallest possible positioning tolerance and a reliable solder
connection can be achieved.
SIPLACE Nozzle 3081899
1.05
2.4
1.25
0.78
0.3
2.3
3
0.3
