Osram LE A P1MQ Скачать руководство пользователя страница 14

www.osram-os.com

14 / 18

2020-06-04  |   Document No.: AN149 

Handling recommendations

Please be aware of ESD safety while handling the LED (see Application Note
“ESD protection while handling LEDs”). In addition to the general guidelines for
the handling of LEDs, additional care should be taken that mechanical stress
(e.g. sheering forces) on to the elastic silicone encapsulation is eliminated or
reduced to the greatest extent possible (see also application note “Handling of
silicone resin LEDs”).

Although manual handling and assembly is possible, automatic placement is
highly recommended. For manual assembly and placement — in the production
of prototypes, for example — the diligent use of tweezers is recommended. The
LED must not be lifted from the top, because this may cause damage to the
surface. In addition, it is recommended to hold the LED metal substrate by using
tweezers and applying any force equally to the entire LED package as shown in
Figure 17. If there is no alternative to the use of tweezers, the LED can be picked
and handled at the metal substrate using finger cots or anti-static plastic gloves. 

In general, any type of sharp objects (e.g. forceps, fingernails, etc.) should be
avoided in order to prevent stress to, or penetration of, the encapsulation since
this can lead to the impairment of the component.

Figure 17:  Recommended manual handling

When processing by means of automated placement machines, care should be
taken to use an appropriate pick-and-place tool and to ensure that the process
parameters comply with the package's characteristics. An example of a suitable
pick-and-place nozzle is given in the form of the ASM SIPLACE tool number
308199. Figure 18 shows the recommended nozzle.

Содержание LE A P1MQ

Страница 1: ...ossible in the application In addition to thermal management correct handling and processing of the LEDs are essential for a successful application This application note provides a recommendation for...

Страница 2: ...systems that require the highest achievable luminance such as projection applications Since an encapsulation with a material comprising a refractive index 1 may lead to an increase in effective tendu...

Страница 3: ...y Files Package CAD Data webpage on the OSRAM Opto Semiconductor website For more information on importing rayfiles and ray measurement files of LEDs from OSRAM Opto Semiconductors please refer to the...

Страница 4: ...nsidered as uncritical for processing and assembly by state of the art SMT equipment aligned with ESD precautions To achieve higher ESD protection on the system level additional ESD protection must be...

Страница 5: ...r on a tray with a dry pack it should be factory sealed when stored The hermetically sealed package should only be opened immediately before mounting and processing after which the remaining LEDs shou...

Страница 6: ...connector size The devices also have a potential free LED backside and the amber and deep blue devices are windowless This avoids losses due to cover reflectivity and stray light Figure 4 shows an ov...

Страница 7: ...ors can be contacted for a detailed drawing Figure 6 Example of a tray Handling recommendations In addition to general guidelines on the handling of LEDs additional care should be taken that mechanica...

Страница 8: ...ts or anti static plastic gloves is recommended to avoid contamination of the products especially in the keep out area If the products are handled using tweezers a round end type is recommended The ti...

Страница 9: ...the LED itself a maximum torque of 0 2 Nm should be used There are 4 holes on the MPCB and it is recommended to use 2 diagonal holes for mounting and another 2 holes for aligning them with the regist...

Страница 10: ...ng part must be protected Here it is recommended to use a step down stencil This should have a suitable integrated cavity for the sensitive LED part of the PCB to protect it during the process Figure...

Страница 11: ...be performed manually but it is recommended that automated assembly with a pick and place machine is used for mass production For the OSRAM OSTAR Projection Power a standard reflow soldering process...

Страница 12: ...e Symbol Pb Free SnAgCu Assembly Unit Min Recommended Max Ramp up rate to preheat 1 25 C to 150 C 2 3 K s Time tS TSmin to TSmax tS 60 100 120 s Ramp up rate to peak 1 TSmax to TP 2 3 K s Liquidus tem...

Страница 13: ...light The converted green LED is cast in silicon to ensure maximum system level efficiency OSRAM OSTAR Projection Power SMT devices have a protective tape covering the chip area Figure 15 for the deep...

Страница 14: ...this may cause damage to the surface In addition it is recommended to hold the LED metal substrate by using tweezers and applying any force equally to the entire LED package as shown in Figure 17 If t...

Страница 15: ...int reliability and heat dissipation for example In most cases it is therefore advantageous to use the recommended solder pad since it is individually adapted to the properties and conditions of the L...

Страница 16: ...sfully used the standard SAC 305 Type 3 solder paste HERAEUS F640 SAC 305 Type 3 For process evaluation process control and failure prevention it is recommended to check the solder paste volume with S...

Страница 17: ...rated thermal pad to the PCB and high board level reliability it is recommended to control the solder joint quality of the first assembled samples with an X ray image The X ray images in Figure 22 sho...

Страница 18: ...nt of rights In no event shall OSRAM Opto Semiconductors GmbH be liable regardless of the legal theory for any direct indirect special incidental exemplary con sequential or punitive damages arising f...

Отзывы: