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2020-06-04  |   Document No.: AN149 

Figure 3: Overview of standard OSRAM OSTAR

®

 Projection Power devices

The newest generation of devices provides series connection of chips which
leads to a reduction of the absolute forward current, and therefore to a lower LED
driver complexity and a smaller connector size. The devices also have a
potential-free LED backside and the amber and (deep) blue devices are
windowless. This avoids losses due to cover reflectivity and stray light. Figure 4
shows an overview of all the devices of this class.

Figure 4: Overview of new generation OSRAM OSTAR

®

 Projection Power with a 

connecting board

LE CG P2A

LE CG P1A

LE CG P3A

LE B P1W

LE B P2W

LE B P3W

LE A P1W

LE A P2W

LE A P3W

LE CG P2AQ

LE CG P1AQ

LE CG P3AQ

LE B P1MQ

LE B P2MQ

LE B P3MQ

LE A P1MQ

LE A P2MQ

LE A P3MQ

Содержание LE A P1MQ

Страница 1: ...ossible in the application In addition to thermal management correct handling and processing of the LEDs are essential for a successful application This application note provides a recommendation for...

Страница 2: ...systems that require the highest achievable luminance such as projection applications Since an encapsulation with a material comprising a refractive index 1 may lead to an increase in effective tendu...

Страница 3: ...y Files Package CAD Data webpage on the OSRAM Opto Semiconductor website For more information on importing rayfiles and ray measurement files of LEDs from OSRAM Opto Semiconductors please refer to the...

Страница 4: ...nsidered as uncritical for processing and assembly by state of the art SMT equipment aligned with ESD precautions To achieve higher ESD protection on the system level additional ESD protection must be...

Страница 5: ...r on a tray with a dry pack it should be factory sealed when stored The hermetically sealed package should only be opened immediately before mounting and processing after which the remaining LEDs shou...

Страница 6: ...connector size The devices also have a potential free LED backside and the amber and deep blue devices are windowless This avoids losses due to cover reflectivity and stray light Figure 4 shows an ov...

Страница 7: ...ors can be contacted for a detailed drawing Figure 6 Example of a tray Handling recommendations In addition to general guidelines on the handling of LEDs additional care should be taken that mechanica...

Страница 8: ...ts or anti static plastic gloves is recommended to avoid contamination of the products especially in the keep out area If the products are handled using tweezers a round end type is recommended The ti...

Страница 9: ...the LED itself a maximum torque of 0 2 Nm should be used There are 4 holes on the MPCB and it is recommended to use 2 diagonal holes for mounting and another 2 holes for aligning them with the regist...

Страница 10: ...ng part must be protected Here it is recommended to use a step down stencil This should have a suitable integrated cavity for the sensitive LED part of the PCB to protect it during the process Figure...

Страница 11: ...be performed manually but it is recommended that automated assembly with a pick and place machine is used for mass production For the OSRAM OSTAR Projection Power a standard reflow soldering process...

Страница 12: ...e Symbol Pb Free SnAgCu Assembly Unit Min Recommended Max Ramp up rate to preheat 1 25 C to 150 C 2 3 K s Time tS TSmin to TSmax tS 60 100 120 s Ramp up rate to peak 1 TSmax to TP 2 3 K s Liquidus tem...

Страница 13: ...light The converted green LED is cast in silicon to ensure maximum system level efficiency OSRAM OSTAR Projection Power SMT devices have a protective tape covering the chip area Figure 15 for the deep...

Страница 14: ...this may cause damage to the surface In addition it is recommended to hold the LED metal substrate by using tweezers and applying any force equally to the entire LED package as shown in Figure 17 If t...

Страница 15: ...int reliability and heat dissipation for example In most cases it is therefore advantageous to use the recommended solder pad since it is individually adapted to the properties and conditions of the L...

Страница 16: ...sfully used the standard SAC 305 Type 3 solder paste HERAEUS F640 SAC 305 Type 3 For process evaluation process control and failure prevention it is recommended to check the solder paste volume with S...

Страница 17: ...rated thermal pad to the PCB and high board level reliability it is recommended to control the solder joint quality of the first assembled samples with an X ray image The X ray images in Figure 22 sho...

Страница 18: ...nt of rights In no event shall OSRAM Opto Semiconductors GmbH be liable regardless of the legal theory for any direct indirect special incidental exemplary con sequential or punitive damages arising f...

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