
3
V700-L11
User's Manual
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Introduction
To operate the system more reliably and to allow the system to fully perform as designed, follow the
instructions below:
■
About environments of installation
Do not install or leave the product to a location such as:
• Location subjected to direct sunlight
• Location where corrosive gas, dust, metal dust, salty air is present
• Location where the operating temperature can exceed or drop below a range defined in the specifica-
tion
• Location where temperature change is great, and can lead to dew condensation
• Location with higher humidity, and can lead to dew condensation
• Location where vibration or impact whose magnitude greater than specified can be directly transmit-
ted to the product proper
• Location where splash of water, oil or chemical product is present
■
About installation
• This product operates on the 125 kHz frequency band to communicate with an ID tag. Certain trans-
ceivers, motors, monitors, and power supplies (power ICs) can emit a radio frequency wave (noise)
that can adversely affect communications with an ID tag. When planning to use the product near such
a source, study the possible result in advance.
• To minimize the possible noise interference, earth-ground (class D earth work) a metal object that will
be located around the product.
■
About wiring work
• Be sure to earth-ground the product per class D earth work. Otherwise, the product will not perform
as designed.
• Before starting a wiring work or disconnecting a cable, be sure to power OFF the product.
• Do not run the cable for the product in a conduit common to a high voltage line and a power supply
line.
• To avoid static-induced failure, wear a wrist band or equivalent means to release a static charge
before touching a terminal or a signal line within a connector.
■
About thread glue
• A thread glue can deteriorate and lead to crack on a resin part. Thus, do not apply a thread glue to
the threading on a resin part or to resin-made washers.
■
About cleaning
• NEVER use an organic solvent such as thinner or benzene, as it will attack resin components or case
coating.
Precautions for Correct Use