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4/2022

NXP Semiconductors

UM11401

FRDMGD31RPEVM half-bridge evaluation board

10 Legal information

10.1  Definitions

Draft

 — A draft status on a document indicates that the content is still

under internal review and subject to formal approval, which may result

in modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included in a draft version of a document and shall have no

liability for the consequences of use of such information.

10.2  Disclaimers

Limited warranty and liability

 — Information in this document is believed

to be accurate and reliable. However, NXP Semiconductors does not

give any representations or warranties, expressed or implied, as to the

accuracy or completeness of such information and shall have no liability

for the consequences of use of such information. NXP Semiconductors

takes no responsibility for the content in this document if provided by an

information source outside of NXP Semiconductors. In no event shall NXP

Semiconductors be liable for any indirect, incidental, punitive, special or

consequential damages (including - without limitation - lost profits, lost

savings, business interruption, costs related to the removal or replacement

of any products or rework charges) whether or not such damages are based

on tort (including negligence), warranty, breach of contract or any other

legal theory. Notwithstanding any damages that customer might incur for

any reason whatsoever, NXP Semiconductors’ aggregate and cumulative

liability towards customer for the products described herein shall be limited

in accordance with the Terms and conditions of commercial sale of NXP

Semiconductors.

Right to make changes

 — NXP Semiconductors reserves the right to

make changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all information supplied prior

to the publication hereof.

Applications

 — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes

no representation or warranty that such applications will be suitable

for the specified use without further testing or modification. Customers

are responsible for the design and operation of their applications and

products using NXP Semiconductors products, and NXP Semiconductors

accepts no liability for any assistance with applications or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suitable and fit for the customer’s applications

and products planned, as well as for the planned application and use of

customer’s third party customer(s). Customers should provide appropriate

design and operating safeguards to minimize the risks associated with

their applications and products. NXP Semiconductors does not accept any

liability related to any default, damage, costs or problem which is based

on any weakness or default in the customer’s applications or products, or

the application or use by customer’s third party customer(s). Customer is

responsible for doing all necessary testing for the customer’s applications

and products using NXP Semiconductors products in order to avoid a

default of the applications and the products or of the application or use by

customer’s third party customer(s). NXP does not accept any liability in this

respect.

Suitability for use in automotive applications

 — This NXP

Semiconductors product has been qualified for use in automotive

applications. Unless otherwise agreed in writing, the product is not designed,

authorized or warranted to be suitable for use in life support, life-critical or

safety-critical systems or equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in personal injury, death or severe property or environmental

damage. NXP Semiconductors and its suppliers accept no liability for

inclusion and/or use of NXP Semiconductors products in such equipment or

applications and therefore such inclusion and/or use is at the customer's own

risk.

Export control

 — This document as well as the item(s) described herein

may be subject to export control regulations. Export might require a prior

authorization from competent authorities.

Evaluation products

 — This product is provided on an “as is” and “with all

faults” basis for evaluation purposes only. NXP Semiconductors, its affiliates

and their suppliers expressly disclaim all warranties, whether express,

implied or statutory, including but not limited to the implied warranties of

non-infringement, merchantability and fitness for a particular purpose. The

entire risk as to the quality, or arising out of the use or performance, of this

product remains with customer. In no event shall NXP Semiconductors, its

affiliates or their suppliers be liable to customer for any special, indirect,

consequential, punitive or incidental damages (including without limitation

damages for loss of business, business interruption, loss of use, loss of

data or information, and the like) arising out the use of or inability to use

the product, whether or not based on tort (including negligence), strict

liability, breach of contract, breach of warranty or any other theory, even if

advised of the possibility of such damages. Notwithstanding any damages

that customer might incur for any reason whatsoever (including without

limitation, all damages referenced above and all direct or general damages),

the entire liability of NXP Semiconductors, its affiliates and their suppliers

and customer’s exclusive remedy for all of the foregoing shall be limited to

actual damages incurred by customer based on reasonable reliance up to

the greater of the amount actually paid by customer for the product or five

dollars (US$5.00). The foregoing limitations, exclusions and disclaimers shall

apply to the maximum extent permitted by applicable law, even if any remedy

fails of its essential purpose.

Translations

 — A non-English (translated) version of a document is for

reference only. The English version shall prevail in case of any discrepancy

between the translated and English versions.

Security

 — Customer understands that all NXP products may be subject

to unidentified or documented vulnerabilities. Customer is responsible

for the design and operation of its applications and products throughout

their lifecycles to reduce the effect of these vulnerabilities on customer’s

applications and products. Customer’s responsibility also extends to other

open and/or proprietary technologies supported by NXP products for use

in customer’s applications. NXP accepts no liability for any vulnerability.

Customer should regularly check security updates from NXP and follow up

appropriately. Customer shall select products with security features that best

meet rules, regulations, and standards of the intended application and make

the ultimate design decisions regarding its products and is solely responsible

for compliance with all legal, regulatory, and security related requirements

concerning its products, regardless of any information or support that may

be provided by NXP. NXP has a Product Security Incident Response Team

(PSIRT) (reachable at [email protected]) that manages the investigation,

reporting, and solution release to security vulnerabilities of NXP products.

10.3  Trademarks

Notice: All referenced brands, product names, service names and

trademarks are the property of their respective owners.

Kinetis

 — is a trademark of NXP B.V.

NXP

 — wordmark and logo are trademarks of NXP B.V.

SafeAssure

 — is a trademark of NXP B.V.

UM11401

All information provided in this document is subject to legal disclaimers.

© NXP B.V. 2021. All rights reserved.

User guide

Rev. 2 — 22 January 2021

32 / 34

Содержание SAFE ASSURE FRDMGD31RPEVM

Страница 1: ...for RF Wireless IoT Power Technologies www richardsonrfpd com 800 737 6937 630 262 6800 4 2022 UM11401 FRDMGD31RPEVM half bridge evaluation board Rev 2 22 January 2021 User guide 1 FRDMGD31RPEVM Figu...

Страница 2: ...this evaluation kit not meet the specifications indicated in the kit it may be returned within 30 days from the date of delivery and will be replaced by a new kit NXP reserves the right to make chang...

Страница 3: ...tains the most relevant current information applicable to the FRDMGD31RPEVM 1 Go to http www nxp com FRDMGD31RPEVM 2 On the Overview tab locate the Jump To navigation feature on the left side of the w...

Страница 4: ...are for interfacing a PC installed with FlexGUI software for communication to the serial peripheral interface SPI registers on the GD3100 gate drive devices in either daisy chain or standalone configu...

Страница 5: ...e capable of 10 A peak source and sink Interrupt pin for fast response to faults Compatible with negative gate supply Compatible with 200 V to 1700 V IGBTs power range 125 kW Table 1 Device features 4...

Страница 6: ...Low voltage logic and control connector Low voltage domain is 12 V VSUP domain that interfaces with the MCU and GD3100 control registers through the 24 pin connector interface Low side driver and hig...

Страница 7: ...BL chip select bar low side 4 n c not connected 5 PWML pulse width modulation PWM input low side 6 INTBL interrupt bar low side 7 MOSIL master out slave in low side 8 SCLK serial clock input 9 MISOL m...

Страница 8: ...de and low side 20 AOUTH duty cycle encoded signal high side 21 PWMH PWM input high side 22 FSSTATEH fail safe state high side 23 GND ground 24 INTBH interrupt bar high side Table 2 Low voltage domain...

Страница 9: ...ver grounding points GL module gate test point on low side driver domain which is the charging pin of gate including MMCX probe connection COLL collector test point connection terminal on low side Hig...

Страница 10: ...tion Jumper Position Function 1 2 dead time fault protection enabled high side PWMHSEL J10 2 3 dead time fault protection disabled use for short circuit testing 1 2 dead time fault protection enabled...

Страница 11: ...high driver and RoadPak module gate that controls the turn on current for SiC MOSFET gate RGL gate low resistor in series with the GL pin at the output of the GD3100 gate low driver and RoadPak modul...

Страница 12: ...P Semiconductors UM11401 FRDMGD31RPEVM half bridge evaluation board Figure 7 Gate drive resistors 4 4 6 LED interrupt indicators Figure 8 LED interrupt indicators UM11401 All information provided in t...

Страница 13: ...ve LOW High side INTB connected to the INTB interrupt output pin of high side driver indicating reported fault status when on active LOW Table 5 LED interrupt indicators 4 5 Kinetis KL25Z Freedom boar...

Страница 14: ...ects PWM high side control from KL25Z MCU PWMH_SEL J4 2 3 selects PWM high side control from fiber optic receiver inputs 1 2 selects PWM low side control from KL25Z MCU PWML_SEL J5 2 3 selects PWM low...

Страница 15: ...power supply for VSUP 12 V DC gate drive board low voltage domain Voltmeter for monitoring high voltage DC link supply Load coil for double pulse and short circuit testing Figure 11 Evaluation board a...

Страница 16: ...up and interface By default the FRDM KL25Z delivered with this kit is preprogrammed with the current and most up to date firmware available for the kit A way to check quickly that the microcode is pro...

Страница 17: ...GD31RPEVM and the FlexGUI a There is no software stored or present on either the driver or translator boards only on the FRDM KL25Z MCU board All uploaded firmware is stored in non volatile memory unt...

Страница 18: ...UM11401 FRDMGD31RPEVM half bridge evaluation board Figure 13 Kit selection FlexGUI settings Access settings by selecting Settings from the File menu Figure 14 GUI settings menu UM11401 All informatio...

Страница 19: ...P Semiconductors UM11401 FRDMGD31RPEVM half bridge evaluation board The Loader and Logs settings are shown below Figure 15 Loader settings Figure 16 Logs settings UM11401 All information provided in t...

Страница 20: ...EVM half bridge evaluation board Access settings by selecting Settings from the File menu The Register Map and Tabs settings are shown below Figure 17 Register map settings Figure 18 Tabs settings UM1...

Страница 21: ...about application events Figure 19 Command Log area Global workspace controls Always visible in the lower left corner of the main application window GD3160 tab functionality Switch modes between run a...

Страница 22: ...able EN_PS enables flyback supply on EVB at 17 V VCC on high side and low side FSSTATEL and FSSTATEH set the fail safe state when FSENB is enabled PWML and PWMH set the default state PWM inputs for hi...

Страница 23: ...independent lines to read and write the registers Individual registers can be read by clicking the R button and can be written by using the W button Copy button to copy the read values to the write li...

Страница 24: ...rovides a more intuitive visual way to set parameters All settings are automatically synchronized with the register controls Figure 25 Gate drive tab Current Sense tab Allows setting of parameters rel...

Страница 25: ...ab DESAT Seg Drive tab Allows setting of parameters related to desat and segmented drive Provides a more intuitive visual way to set parameters All settings are automatically synchronized with the reg...

Страница 26: ...y to set parameters All settings are automatically synchronized with the register controls Figure 28 Overtemperature tab Undervoltage threshold tab Allows setting of parameters related to undervoltage...

Страница 27: ...ing and graphing of ADC and temperature values Figure 30 Measurements tab Status tab Allows monitoring of Status 1 Status 2 and Status 3 register values Status 1 and Status 2 faults can be cleared Sta...

Страница 28: ...t and PWM testing Select desired T1 T2 and T3 timings for each test type select enable then generate pulses Figure 32 Pulse tab 6 4 Troubleshooting Some common issues and troubleshooting procedures ar...

Страница 29: ...t fault indicates that PWM controls signals are in violation Clear DTFLT fault bit STATUS2 Check PWMHSEL J10 and PWMLSEL J9 are configured to bypass dead time faults Consider adjusting dead time setti...

Страница 30: ...tive voltage it could cause excessive VCC level Check Zener diode in power supply circuit for proper value in setting VEE level Clear VCCOV bit STATUS1 to continue VCCOV fault reported on startup Chec...

Страница 31: ...GD31RPEVM half bridge evaluation board 9 Revision history Revision Date Description v 2 20210122 Section 6 2 list item 6a changed FlexGUI version v 1 20200803 initial version Revision history UM11401...

Страница 32: ...ty critical systems or equipment nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury death or severe property or e...

Страница 33: ...ED interrupt indicators 12 Fig 9 Freedom development platform 13 Fig 10 Translator board 14 Fig 11 Evaluation board and system setup 15 Fig 12 FRDM KL25Z setup and interface 16 Fig 13 Kit selection 18...

Страница 34: ...ve resistors 11 4 4 6 LED interrupt indicators 12 4 5 Kinetis KL25Z Freedom board 13 4 6 3 3 V to 5 0 V translator board 14 5 Configuring the hardware 14 6 Installation and use of software tools 15 6...

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