NXP Semiconductors KIT912J637EVME, Руководство пользователя

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KT912J637UG, Rev. 1.0
Freescale 9
Hardware Description
6.1.1 MCU
The MM912J637 enables precision measurement of key battery parameters in automotive and other
applications.
The device integrates an HCS12 microcontroller and a SMARTMOS analog control IC into a single package
solution. The analog die combines system basis and application specific functions, including a Local
Interconnect Network (LIN) transceiver, and 3 dedicated16-bit sigma delta analog to digital converters (ADC)
for synchronous measurement of battery voltage, current, and temperature.
An integrated temperature sensor combined with battery mounting allows for measurement of battery
temperature. Control of the analog die is via a new high performance internal die-to-die interface (D2D), which
seamlessly integrates the analog IC registers into the MCU register map, providing faster access than
SPI-based systems. The MM912J637 also includes an internal oscillator, 128 k Bytes of Flash memory, and
6.0 k bytes of RAM. An optional external temperature sensor is also supported.
The 912J637 has three main operating modes: Normal (all functions available); Sleep (V
DD
off, Wake-up via:
the LIN bus, PTB3/L0 input, current threshold, current averaging, calibration request, lifetime counter, internal
timer, or external reset), and Stop (V
DD
on with limited current capability, Wake-up via: the LIN bus, PTB3/L0
input, current threshold, current averaging, calibration request, lifetime counter, internal timer, or external reset).
6.1.2 TBDML
The Turbo BDM Light interface is a programming and debugging tool, and constitutes an interface between a
PC and the BDM debugging port of Freescale microcontrollers. It enables the debugger and other software tools
to communicate with the microcontroller, and download code into its on-chip flash, etc. Among the benefits of
using the TBDML on the EVB is a much higher communication speed than other USB/BDM interfaces. It is also
unnecessary to connect external devices to the EVB when programming/debugging is needed.
A BDM connector (CON9) is placed on the EVB to allow the connection of another BDM tool, such as
the P&E
USB BDM Multilink
. In this case, DIP switches S2-1 and S2-2 should be set to “OFF”, to disable the TBDML
interface.
In either case, S2-3 should be set to “OFF” during programming to disconnect RESET from RESET_A.
6.1.2.1 Switch Settings
Figure 4 summarizes the location of all DIP switches and settings.