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Table 8. 8MMINI-BB Board stack up information (continued)
Layer
Description
Coppoer (Oz.)
Dielectric thickness (mil)
Dielectric
12.89 mil
4
Power
1
Dielectric
11.81 mil
5
Power
1
Dielectric
12.89 mil
6
Signal
1
Dielectric
4.33 mil
7
GND
1
Dielectric
2.77 mil
8
Signal
0.5+Plating
Total thickness:
62.992(6.299/-6.299) mil
1.6(+0.16/-0.16) MM
Material:
TU768
TU768
3.1 EVK design files
You can download the schematics, layout files, gerber files, and BOM from
Evaluation Kit for the i.MX 8M Nano
.
NXP Semiconductors
PCB information
i.MX 8M Nano UltraLite DDR3L Evaluation Kit Hardware User's Guide, Rev. 0, March 2, 2021
User's Guide
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