NXP Semiconductors i.MX 8M Nano UltraLite DDR3L, Руководство пользователя по оборудованию, Страница: 15 / 17

Chapter 3
PCB information
The i.MX 8M Nano DDR3L EVK is composed of 8MNANOD3L-CPU and 8MMINI-BB. Table 1 lists the dimensions of the two
boards. The 8MNANOD3L-CPU board is made with standard 6-layer technology while 8MMINI-BB is eight layers. The material
is FR-4, and the PCB stack-up information is as shown in
Table 7 and Table 8 .
Table 7. 8MNANOD3L-CPU Board stack up information
Layer Description Coppoer (Oz.) Dielectric thickness (mil)
1 Signal 0.5+Plating
Dielectric 2.76 mil
2 GND 1
Dielectric 2.95 mil
3 Signal 1
Dielectric 25.28 mil
4 Power 1
Dielectric 2.95 mil
5 Power 1
Dielectric 2.76 mil
6 Signal 0.5+Plating
Total thickness: 47.24(4.72/-4.72) mil 1.2(+0.12/-0.12) MM
Material: TU768 TU768
Table 8. 8MMINI-BB Board stack up information
Layer Description Coppoer (Oz.) Dielectric thickness (mil)
1 Signal 0.5+Plating
Dielectric 2.77 mil
2 GND 1
Dielectric 4.33 mil
3 Signal 1
Table continues on the next page...
NXP Semiconductors
i.MX 8M Nano UltraLite DDR3L Evaluation Kit Hardware User's Guide, Rev. 0, March 2, 2021
User's Guide 15 / 17