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TFE-4/RV-1
Company Confidential
TF4 Technical Information
Nokia Customer Care
Page 8b-16
Copyright
©
2005
Nokia Corporation.
Issue 2.0 Mar/2005
Company Confidential
The MCU consist of a 16/32–bit RISC core (ARM7). The block has a small ROM (768x32
bits) for MCU boot code. It interfaces to DSP through the 8Mbit PDRAM. The MCU has it
own sectors in the RAM as well as the DSP. RAM blocks or sectors are divided into the
following:
4 x 64Kbytes for the DSP and MCU.
4 x 64KB Banks, MCU only.
2 x 4KB Banks, for the DSP, and MCU.
The rest of the PDRAM is used for program code, mainly GPRS SW.
Bluetooth
TF4 has a Bluetooth module BT102 that receives and transmit at 2.4GHz. This module
enables the phone to communicate via a radio link with other Bluetooth units e.g. head-
sets, carkits or printers or to use a linked phone via SAP-link as remote SIM-card. The
Bluetooth module is itself made as a multilayer PWB – covering all the needed Asics and
discrete components – with a shielding frame- and lid. The module is soldered onto the
phone PWB in the same way as other SMD components.
BT102 Flash programming
The
Bluetooth MCM
SW needs to be programmed when the module is assembled into the
phone. This is implemented by interleaving so that code data is being transferred to the
BT102 while the main flash is performing the internal programming of the phone SW.
The figure below illustrates the set-up used for BT102 flash programming.
Figure 6: BT102 flash programming
UEM
Level shift
UPP
MBUS
FBUS-Tx
FBUS-Rx
CBUS-Clk
CBUS-Data
CBUS-ENx
LPRFINTREQ
BT102
Prommer
Main Flash
Men IF
MBUS
FBUS-Tx
FBUS-Rx