Nokia Mobile Phones NSE-5 Series, Руководство по обслуживанию

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PAMS
Technical Documentation
NSE–5
System Module
Page 2 – 8
Issue 1 07/99
Table 2. Mic signals of the system connector
NA
MICN
mouted
in slide
0 2 12.5 mV Connected to COBBA_GJP MIC2N
input. The maximum value corre-
sponds to1 kHz, 0 dBmO network
level with input amplifier gain set to
32 dB. typical value is maximum
value – 16 dB.
NA MICP
mounted
in slide
0 2 12.5 mV Connected to COBBA_GJP MIC2P
input. The maximum value corre-
sponds to1 kHz, 0 dBmO network
level with input amplifier gain set to
32 dB. typical value is maximum
value – 16 dB.
Table 3. System/IBI connector
Pin IB-
pin
Name Function Min Typ Max Unit Description
10 Yes XEAR Analog
audio out-
47
W
Output AC impedance (ref.
GND) resistor tol. is 5%
aud u
put
(from
10
m
F Series output capacitance
(from
phone to
accessory
16 300
W
Load AC impedance to GND:
Headset
accessory
4.7 10 k
W
Load AC impedance to
SGND: External accessory.
1.0 V
p–p
Max. output level. No load
100 k
W
Resistance to accessory
ground (in accessory)
Accessory
detection
(f
0.5 V DC Voltage (ref. SGND). Ex-
ternal accessory
de ec
(fom ac-
cessory to
phone)
6.8 k
W
Load DC resistance to
SGND. External accessory
phone)
0 0.2 V DC Voltage (ref. SGND).
Headset with closed switch
16 1500
W
Load DC resistance to
SGND. Headset with closed
switch
2.8 V DC Voltage (ref. SGND). No
accessory, or headset with
open switch
47 k
W
Pull–up resistor to VBB in
phone