22
µ
PD78214 Sub-Series
Product
Item
Quality grade
Package
Standard
• 64-pin plastoc shrink DIP
• 64-pin plastic QFP
• 74-pin plastic QFP
µ
PD78212
µ
PD78212(A)
Special
• 64-pin plastoc shrink DIP
• 64-pin plastic QFP
Product
Item
Quality grade
Maximum period in which 74-
pin plastic QFPs can be soldered
satisfactorily, after their sealed
packaging has been opened
Package
Standard
• 64-pin plastic shrink DIP
• 64-pin plastic QFP
Note
• 74-pin plastic QFP
Note
• 64-pin plastic QUIP
• 68-pin plastic QFJ
Note
µ
PD78213,
µ
PD78214
µ
PD78213(A),
µ
PD78214(A)
Special
Product
Item
Quality grade
Package
Standard
• 64-pin plastic shrink DIP
• 64-pin ceramic shrink DIP with window
• 64-pin plastic QFP
• 74-pin plastic QFP
• 64-pin plastic QUIP
• 68-pin plastic QFJ
µ
PD78P214
µ
PD78P214(A)
Special
• 64-pin plastic shrink DIP
• 64-pin plastic QFP
No limit
Seven days
1.9 DIFFERENCES BETWEEN THE
µ
PD78212 AND
µ
PD78212(A)
1.10 DIFFERENCES BETWEEN THE
µ
PD78213 AND
µ
PD78214, AND THE
µ
PD78213(A) AND
µ
PD78214(A)
Note
Not supported for the
µ
PD78213(A)
1.11 DIFFERENCES BETWEEN THE
µ
PD78P214 AND
µ
PD78P214(A)
Содержание PD78212
Страница 11: ......
Страница 53: ...24 ...
Страница 61: ...32 µPD78214 Sub Series 9 VSS Ground 10 NC non connection Not connected inside the chip ...
Страница 65: ...36 ...
Страница 83: ...54 ...
Страница 135: ...106 ...
Страница 271: ...242 ...
Страница 405: ...376 ...
Страница 417: ...388 ...
Страница 423: ...394 ...
Страница 449: ...420 ...
Страница 457: ...428 ...
Страница 471: ...442 ...
Страница 487: ...458 ...