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Murata Electronics Oy

Assembly Instructions for Murata's SCC1000 series

TN82

www.murata.com

Rev. 2.0

Tape and reel specifications

Packing tape dimensions are presented in Figure 3. The unreeling direction and component
polarity on tape are presented in Figure 4.

Figure 3. Packing tape dimensions for the DIL-32 Package. Dimensions are in millimeters [mm].

Figure 4. Package orientation on the tape and unreeling direction on tape.

Direction of unreeling

PIN 1 IDENTIFIER

SCC1xx0_1640-21648-0004-E-0519

Содержание SCC1000 Series

Страница 1: ...1 17 Murata Electronics Oy Assembly Instructions for Murata s SCC1000 series TN82 www murata com Rev 2 0 ASSEMBLY INSTRUCTIONS FOR SCC1000 SERIES Technical Note 82 1 SCC1xx0_1640 21648 0004 E 0519...

Страница 2: ...ent picking and placement 8 5 6 Reflow soldering 9 5 7 Moisture sensitivity level MSL classification 10 5 8 Inspection 10 5 9 Precautions 12 5 9 1 Mechanical shocks 12 5 9 2 Vibration 12 5 9 3 Chemica...

Страница 3: ...ulfill the needs of varying end use applications 2 Murata s 32 lead Dual In line Package DIL 32 The SCC1000 series products are SMD DIL 32 components pick and place mountable and reflow solderable The...

Страница 4: ...3 DIL 32 Package Outline and Dimensions The outline and dimensions for the DIL 32 package are presented in Figure 2 Figure 2 Outline and dimensions for DIL 32 package Dimensions are in millimeters mm...

Страница 5: ...mensions are presented in Figure 3 The unreeling direction and component polarity on tape are presented in Figure 4 Figure 3 Packing tape dimensions for the DIL 32 Package Dimensions are in millimeter...

Страница 6: ...com Rev 2 0 The reel dimensions are presented in Figure 5 and Table 1 below Dimensions are in millimeters mm Figure 5 Reel dimensions All dimensions are in millimeters mm Table 1 Packing reel dimensi...

Страница 7: ...d with lead free SAC tin silver copper solder The SAC solder paste composition should be near eutectic The melting point of lead free SAC solder can vary between 217 221 C depending on the composition...

Страница 8: ...ecting any of these can cause open solder joints bridging solder balling or other unwanted soldering results 5 5 Component picking and placement The DIL package can be picked from the carrier tape usi...

Страница 9: ...sification reflow profiles according to IPC JEDEC J STD 020D Profile feature Sn Pb Eutectic Assembly Pb free Assembly Preheat Temperature min Tsmin Temperature max Tsmax Time min to max ts 100 C 150 C...

Страница 10: ...ined in Table 2 Following instruction shall be followed 1 Calculated shelf life in sealed bag 12 months at 40 C and 90 relative humidity RH 2 Maximum soldering peak temperature for the package is defi...

Страница 11: ...lectronics Oy Assembly Instructions for Murata s SCC1000 series TN82 www murata com Rev 2 0 Figure 8 Cross section of the DIL package lead s solder joint with eutectic SnPb solder 11 SCC1xx0_1640 2164...

Страница 12: ...both prior to or during assembly Many assembly processes can induce vibration typical ones being PCB singulation mechanical shocks transportation friction welding and ultra sonic cleaning Reference t...

Страница 13: ...must be removed from the board The package maximum temperature should be kept under 245 C and all mechanical stresses in the pin should be minimized It should be noted that also PCB material might da...

Страница 14: ...nt gently on top of the solder paste To avoid solder bridging push only very gently on top of the component 3 i Melt the solder paste by putting the part through reflow oven or ii by using soldering i...

Страница 15: ...280 C If the pins are heated too long the plastic around pin will be softened and if there at the same time is some stress on the pin there is a risk that pin might move and cause increased reliabilit...

Страница 16: ...ely after solder melting component is lifted Remove the solder from the PCB using either a solder vacuum or solder braid making sure to clean the area of solder thoroughly Figure 14 Soldering iron and...

Страница 17: ...ould be soldered with lead free solders in order to guarantee full RoHS compatibility 9 References JEDEC Electronic Industries Alliance Inc Moisture Reflow Sensitivity Classification for Non Hermetic...

Страница 18: ...for you Addresses and Contacts Headquarter Switzerland Angst Pfister Sensors and Power AG Thurgauerstrasse 66 CH 8050 Zurich Phone 41 44 877 35 00 sensorsandpower angst pfister com Office Germany Ang...