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Murata Electronics Oy
Assembly Instructions for Murata's SCC1000 series
TN82
www.murata.com
Rev. 2.0
5.9 Precautions
MEMS sensors are mechanically and electrically sensitive components. Following sections
describe typical processes or treatments, but are not limited to, which may be harmful for sensor
component. Exceeding these limits or neglecting these guidelines may lead to malfunction of
sensor component.
The reliability requirements for the devices are applied and validated according to AEC-Q100 Rev.
G.
5.9.1 Mechanical shocks
Mechanical shocks should be avoided. The level depends heavily on the pulse width and shape
and should be evaluated case by case. As a general guideline, the lighter assembly or part, the
higher shock levels will be generated on sensor component. Shocks may cause mechanical
damage to the internal structures of MEMS sensor.
Reference tests:
1. Mechanical Shock JEDEC JESD22-B104, Y1 plane, 5 pulses, 0.5 msec duration, 1500 g peak
acceleration.
2. Package Drop AEC-Q100 Rev G, device drop on each of 6 axes once from a height of 1.2m
onto a concrete surface.
5.9.2 Vibration
Vibration of the device should be avoided both prior to or during assembly. Many assembly
processes can induce vibration, typical ones being PCB singulation, mechanical shocks,
transportation, friction welding and ultra-sonic cleaning.
Reference test:
1. (1) Variable Frequency Vibration, JEDEC JESD22-B103, 20 Hz to 2 KHz to 20 Hz in >4
minutes, 4X in each orientation, 50 g acceleration.
5.9.3 Chemicals
Sensor components shall not be exposed to chemicals which are known to react with silicones,
such as solvents. Sensor components shall not be exposed to chemicals with high impurity levels,
such as Cl-, Na+, NO3-, SO4-, NH4+ in excess of >10 ppm. Flame retardants such as Br or P
containing materials shall be avoided in close vicinity of sensor component. Materials with high
amount of volatile content should also be avoided.
If heat stabilized polymers are used in application, user should check that no iodine, or other
halogen, containing additives are used. Copper iodide is known to cause issues with gold
aluminium interconnects.
5.9.4 Coatings
Coatings on sensor component are not generally recommended. If required, the effect of coating
on sensor component reliability and electrical performance has to be evaluated case by case. As a
general guideline, lower the viscosity or higher the modulus of coating, higher the probability of
adverse effects on sensor component.
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