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Murata Electronics Oy
Assembly Instructions for Murata's SCC1000 series
TN82
www.murata.com
Rev. 2.0
7.1 Instructions for desoldering and removing of component
Soldering Station (Pace SensaTemp ST25E-PS90) and thermal tweezers (Pace Thermotweez)
with Pace 1121-0416-P1 tool head are used for de-soldering and removing of the component.
Figure 10. Pace SansaTemp ST25E-PS90
Figure 11. (Left) Thermal tweezers, Pace Thermotweez. (Right) Tool head, Pace 1121-0416-P1.
The plastic molding compound on the component is LCP (liquid crystal polymer) which withstands
very high temperatures and is good material for Pb-free assembly. LCP's melting point is 335ºC.
However, the mechanical properties start to change already near 280ºC. If the pins are heated too
long the plastic around pin will be softened and if there at the same time is some stress on the pin
there is a risk that pin might move and cause increased reliability or wirebond break inside housing.
In order to melt all pins simultaneously, tweezers are recommended for de-soldering of the
component. Also with tweezers, special care must be taken if failure analysis or re-use of the
component is desired.
In the component removal process, the temperature setting in soldering station is no315ºC.
The temperature on the tip of the tool is 270...275ºC. Tool is pressed against pins only for few
seconds. Same temperature is used both for Pb-free and SnPb-solder joints, even though SnPb
solders melt already below 200ºC. Some temperature adjustment might be needed. Especially if
tool head is old and 'dirty' temperature needs to be increased.
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SCC1xx0_1640-21648-0004-E-0519
