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Mounting

Continued on the following page.

c

 Standard Land Dimensions

c

 Notice (Soldering and Mounting)

a

c

Solder Resist

(in mm)

b

Land

Chip

Part Number

Soldering

Methods

Chip (L

g

W)

a

Dimensions (mm)

b

c

1.6

g

0.8

Reflow Soldering
Reflow Soldering

0.6-0.8 0.6-0.7 0.6-0.8

1.0

g

0.5

Reflow Soldering

0.5

0.4-0.5

0.5

2.0

g

1.25

1.0-1.2 0.5-0.7 1.0-1.2

PRG15
PRG18
PRG21

To remove the flux after soldering, observe the following 

points in order to avoid deterioration of the characteristics 

or any change to the external electrodes' quality.

2-propanol

Less than 5 minutes

at room temp.

or

Less than 2 minutes

at 40˚C max.

Less than 1 minute

20W/L Frequency

of several 10kHz

to 100kHz.

Solvent

Dipping Cleaning

Ultrasonic Cleaning

A sufficient cleaning should be applied to remove flux completely.

(1) Printing Conditions of Solder Paste

(a) Standard thickness of solder paste printing should 

be from 0.15 to 0.20mm.

(b) After soldering, the solder fillet should be a height 

from 0.2mm to the thickness of this product (see the 

figure at right).

(c) Too much solder result in excessive mechanical 

stress to this product. Such stress may cause 

cracking or other mechanical damage. Also, it can 

destroy the electrical performance of this product.

In your mounting process, observe the following points in 

order to avoid deterioration of the characteristics or 

destruction of this product. The mounting quality of this 

product may also be affected by the mounting conditions, 

shown in the points below.

This product is for reflow soldering only. Flow soldering 

should not be allowed.

0.2mm 

V

 T 

V

 E

T

Solder

Solder

Electrode

1. Solder and Flux

2. Cleaning Conditions

3. Soldering Conditions

(1) Solder Paste

Use solder paste Sn:Pb=63:37wt%.

For your reference, we are using 

 

63Sn/37Pb RMA9086 90-3-M18, 

manufactured by Alpha Metals Japan Ltd.

 96.5Sn/3.0Ag/0.5Cu 

M705-GRN360-K2-V, 

manufactured by Senju Metal Industry Co., LTD for any 

internal tests of this product.

(2) Flux

Use rosin type flux in the soldering process.

If the flux below is used, some problems might be 

caused in the product characteristics and reliability.

Please do not use these types of flux. 

s3TRONGACIDICFLUXWITHHALIDECONTENTEXCEEDING

0.2wt%).

s7ATERSOLUBLEFLUX

(*Water-soluble flux can be defined as non-rosin type 

flux including wash-type flux and non-wash-type flux.)

E

After cleaning, 

promptly dry 

this product.

Drying

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