Mounting
Continued from the preceding page.
(3) Standard Temperature Profile for Soldering
(a) Insufficient preheating may cause a crack on the
ceramic body. The difference between preheating
temperature and maximum temperature in the profile
should be 100°C.
(b) Rapid cooling by dipping in solvent or by other
means is not recommended.
Soldering
Gradual cooling
(in air)
Preheating (in air)
1 to 2 min.
200
100
0
240°C
Reflow Soldering Conditions
* In the case of repeated soldering, the accumulated soldering
time should be within the range shown in "(2) Allowable
Soldering Temperature and Time."
*20 sec.
Preheating: 150±10°C, 1 to 2 minutes
Soldering: 240°C, 20 sec.
(4) There may be a risk of unexpected failures
(tombstone, insufficient solder-wetting, etc.) in the
mounting process, caused by the mounting conditions.
Please make sure that this product is correctly
mounted under the specified mounting conditions.
(2) Allowable Soldering Temperature and Time
(a) Solder within the temperature and time
combinations, indicated by the slanted lines in the
graphs at right.
(b) Excessive soldering conditions may cause
dissolution of metallization or deterioration of
solder-wetting on the external electrode.
(c) In the case of repeated soldering, the accumulated
soldering time should be within the range shown at
right. (For example, Reflow peak temperature: 260°C,
twice –> The accumulated soldering time at 260°C is
within 15 sec.)
Time (second)
0
10
20
30
40
50
60
260
250
270
240
230
220
210
200
Allowable Reflow Soldering Temp. and Time
Temperature (°C)
Temperature (°C)
