Murata GRM0335C1HR50WD01 Series Скачать руководство пользователя | Manualshive

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P A C K A G I N G
G R M / F T y p e

Chip

Fig.1 Package

Chips

Fig.2 Dimensions of

Reel

2.0

±

0.5

f

21

±

0.8

W

1

W

Fig.3 Taping Diagram

Top Tape : Thickness 0.06

Feeding Hole :As specified in 2.2.

Hole for Chip : As specified in 2.2.

Base Tape : As specified in 2.2.

Bottom Tape :Thickness 0.05
(Only a bottom tape existence )

f

1

8

0

+0

/-

3

.0

f

330

±

2

.0

f

5

0

mi

n

.

(in : mm)

f

13

±

0

.5

W

w

1

GR



02

8.0 max

5

±

1.5

GR



32 max.

16.5 max.

10

±

1.5

GR



43/55

20.5 max.

14

±

1.5

JEMCGP-2694T

9

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...
7
8
9
10
11
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Содержание GRM0335C1HR50WD01 Series

Страница 1: ...ic equipment 0 05 pF 55 to 125 C 0 30 ppm C 25 to 125 C 25 C 3 Temperature Characteristics Public STD Code F EIA e Specifications and Test Methods Operationg Temp Range g Temp coeff or Cap Change 5 Nominal Capacitance 6 Capacitance Tolerance 50 Vdc 0 5 pF Temp Range Ref Temp mark 0 3 0 03 4 DC Rated Voltage 0 1 to 0 2 1 2 W 0 3 0 03 2 T Packaging Unit 1 1 L 0 6 0 03 D f180mm Reel PAPER 15000 pcs R...

Страница 2: ... When cycling the temperature sequentially from step1 through 5 C 25 C to 125 C other temp coeffs 25 C to 85 C the capacitance should be within the specified tolerance for the temperature coefficient and capacitance change as Table A 1 The capacitance drift is caluculated by dividing the differences betweeen the maximum and minimum measured values in the step 1 3 and 5 by the cap value in step 3 2...

Страница 3: ... in a solution of ethanol JIS K 8101 and rosin JIS K 5902 25 rosin in weight propotion Preheat at 80 to 120 C for 10 to 30 seconds After preheating immerse in an eutectic solder solution for 2 0 5 seconds at 230 5 C or Sn 3 0Ag 0 5Cu solder solution for 2 0 5 seconds at 245 5 C 14 Resistance to Soldering Heat The measured and observed characteristics should satisfy the specifications in the follow...

Страница 4: ...rger R6 R7 C8 L8 R9 Within 12 5 E4 F5 Within 30 Q D F 30pF and over Q 350 10pF and over 30pF and below Q 275 C 10pF and below Q 200 10C C Nominal Capacitance pF R6 R7 C8 L8 W V 100V 0 05max C 0 068 F 0 075max C 0 068 F W V 25 50V 0 05max W V 16 10V 0 05max W V 6 3V 4V 0 075max C 3 3 F 0 125max C 3 3 F R9 W V 50V 0 075max E4 W V 25Vmin 0 05max F5 W V 25Vmin 0 075max C 0 1 F 0 125max C 0 1 F W V 16 ...

Страница 5: ...F5 Within 30 40 Cap 1 0 F Q D F 30pF and over Q 350 10pF and over 30pF and below Q 275 C 10pF and below Q 200 10C C Nominal Capacitance pF R6 R7 C8 L8 W V 100V 0 05max C 0 068 F 0 075max C 0 068 F W V 25 50V 0 05max W V 16 10V 0 05max W V 6 3V 4V 0 075max C 3 3 F 0 125max C 3 3 F R9 W V 50V 0 075max E4 W V 25Vmin 0 05max F5 W V 25Vmin 0 075max C 0 1 F 0 125max C 0 1 F W V 16 10V 0 15max W V 6 3V 0...

Страница 6: ...ode L Code J F Code K GR 02 40000 GR 03 15000 50000 GR 15 10000 50000 GR 18 4000 10000 GR 21 5 6 9 4000 10000 A B 3000 10000 GR 31 6 9 4000 10000 M X 3000 10000 C 2000 6000 GR 32 5 6 9 4000 10000 A M 3000 10000 N 2000 8000 C 2000 6000 R D E 1000 4000 GR 43 M 1000 5000 N C R 1000 4000 D 1000 4000 E 500 2000 S 500 1500 GR 55 M 1000 5000 N C R 1000 4000 D 1000 4000 E 500 F X 300 1500 4mm width 1mm pi...

Страница 7: ...2 8 0 2 B 1 85 0 1 2 3 0 15 3 6 0 2 3 6 0 2 Code GR 03 GR 15 A 3 0 37 0 65 3 Nominal value B 3 0 67 1 15 t 0 5 max 0 8 max in mm 1 75 0 1 2 2 1 φ 0 8 0 04 4 0 0 1 8 0 0 3 3 5 0 05 1 2 1 0 0 02 0 05 Max ＡＢ t 1 φ 1 5 0 1 0 ＡＢＢ t 1 2 2 0 0 05 4 0 0 1 4 0 0 1 2 0 0 1 φ1 5 0 1 0 1 75 0 1 8 0 0 3 3 5 0 05 0 8 max T 0 5mm 1 15 max T 0 85mm ＡＢ JEMCGP 2694T 7 ...

Страница 8: ...5 GR 43 55 1 2 5 max T 1 8mm 3 7 max T 2 0 2 5mm 4 7 max T 2 8mm Code GR 43 GR 55 A 2 3 6 5 2 B 2 4 9 6 1 2Nominal value 1 0 3 0 1 0 1 0 0 1 0 f1 5 0 0 0 1 0 0 1 0 8 0 0 1 4 0 0 1 2 0 0 1 12 0 0 3 5 5 0 1 1 75 0 1 A B 0 25 0 1 T 2 0mm 0 3 0 1 T 2 5mm 4 0 0 1 4 0 0 1 2 0 0 1 A B 8 0 0 3 3 5 0 05 1 75 0 1 1 7 max T 1 25mm 2 5 max T 1 35 1 6mm 3 0 max T 1 8 2 0mm 3 7 max T 2 5mm f1 5 0 0 0 1 0 in mm ...

Страница 9: ...iagram Top Tape Thickness 0 06 Feeding Hole As specified in 2 2 Hole for Chip As specified in 2 2 Base Tape As specified in 2 2 Bottom Tape Thickness 0 05 Only a bottom tape existence f 180 0 3 0 f 330 2 0 f 50 min in mm f 13 0 5 W w1 GR 02 8 0 max 5 1 5 GR 32 max 16 5 max 10 1 5 GR 43 55 20 5 max 14 1 5 JEMCGP 2694T 9 ...

Страница 10: ...or top tape and bottom tape 2 9 There are no fuzz in the cavity 2 10 Break down force of top tape 5N min Break down force of bottom tape 5N min Only a bottom tape existence 2 11 Reel is made by resin and appeaser and dimension is shown in Fig 2 There are possibly to change the material and dimension due to some impairment 2 12 Peeling off force 0 1 to 0 6N in the direction as shown below GR 02 03 ...

Страница 11: ...3 2 Case is made by resin of transparence or semitransparency and appeaser and dimension is shown in Fig 4 There are possibility to change the material and dimension due to some impairment 3 3 Case must be marked in Customer s part number MURATA part number MURATA name Inspection number and quantity pcs 110 0 7 31 5 0 35 36 0 0 35 6 8 0 1 8 8 0 1 12 0 0 1 1 5 3 0 2 0 0 0 0 2 0 0 0 0 1 0 0 1 0 0 0 ...

Страница 12: ...ight dust rapid temperature changes corrosive gas atmosphere or high temperature and humidity conditions during storage may affect the solderability and the packaging performance Please use product within six months of receipt 2 Please confirm solderability before using after six months Store the capacitors without opening the original bag Even if the storage period is short do not exceed the spec...

Страница 13: ...citors using your actual appliances at the intended environment and operating conditions Typical temperature characteristics Char R6 X5R Typical temperature characteristics Char R7 X7R Typical temperature characteristics Char F5 Y5V 2 Measurement of Capacitance 1 Measure capacitance with the voltage and the frequency specified in the product specifications 1 1 The output voltage of the measuring e...

Страница 14: ... Pulse voltage E Maximum possible applied voltage 1 2 Influence of overvoltage Overvoltage that is applied to the capacitor may result in an electrical short circuit caused by the breakdown of the internal dielectric layers The time duration until breakdown depends on the applied voltage and the ambient temperature 4 Applied Voltage and Self heating Temperature 1 When the capacitor is used in a hi...

Страница 15: ...ors such as their aging voltage and temperature characteristics And check capacitors using your actual appliances at the intended environment and operating conditions 2 The capacitance values of high dielectric constant type capacitors change depending on the AC voltage applied Please consider the AC voltage characteristics when selecting a capacitor to be used in a AC circuit AC voltage character...

Страница 16: ...rinted circuit board should not be allowed to hit the capacitor in order to avoid a crack or other damage to the capacitor Soldering and Mounting 1 Mounting Position 1 Confirm the best mounting position and direction that minimizes the stress imposed on the capacitor during flexing or bending the printed circuit board 1 1 Choose a mounting position that minimizes the stress imposed on the chip dur...

Страница 17: ...essive forces are not applied to the capacitors 1 1 In mounting the capacitors on the printed circuit board any bending force against them shall be kept to a minimum to prevent them from any bending damage or cracking Please take into account the following precautions and recommendations for use in your process 1 Adjust the lowest position of the pickup nozzle so as not to bend the printed circuit...

Страница 18: ...onditions Infrared Reflow Vapor Reflow Peak Temperature 230 250 230 240 240 260 Atmosphere Air Air Air or N2 Pb Sn Solder Sn 37Pb Lead Free Solder Sn 3 0Ag 0 5Cu In case of repeated soldering the accumulated soldering time must be within the range shown above 4 Optimum Solder Amount for Reflow Soldering 4 1 Overly thick application of solder paste results in a excessive solder fillet height This m...

Страница 19: ...be sure to maintain the temperature difference ΔT between the component and solvent within the range shown in the table 2 4 Do not apply flow soldering to chips not listed in Table 2 Table 2 Temperature Differential In case of repeated soldering the accumulated soldering time must be within the range shown above Recommended Conditions Pb Sn Solder Lead Free Solder 90 110 100 120 240 250 250 260 Ai...

Страница 20: ...Lead Free Solder Sn 3 0Ag 0 5Cu 4 Optimum Solder amount when re working with a Soldering lron 4 1 In case of sizes smaller than 0603 GR 03 15 18 the top of the solder fillet should be lower than 2 3 s of the thickness of the component or 0 5mm whichever is smaller In case of 0805 and larger sizes GR 21 31 32 43 55 the top of the solder fillet should be lower in section than 2 3 s of the thickness ...

Страница 21: ...ormance of a capacitor after mounting on the printed circuit board 1 1 Avoid bending printed circuit board by the pressure of a test pin etc The thrusting force of the test probe can flex the PCB resulting in cracked chips or open solder joints Provide support pins on the back side of the PCB to prevent warping or flexing 1 2 Avoid vibration of the board by shock when a test pin contacts a printed...

Страница 22: ...jig and from the front side of board as below the capacitor may form a crack caused by the tensile stress applied to capacitor Outline of jig 2 Example of a suitable machine An outline of a printed circuit board cropping machine is shown as follows Along the lines with the V grooves on printed circuit board the top and bottom blades are aligned to one another when cropping the board The misalignme...

Страница 23: ...that can cause condensation 2 Others 2 1 In an Emergency 1 If the equipment should generate smoke fire or smell immediately turn off or unplug the equipment If the equipment is not turned off or unplugged the hazards may be worsened by supplying continuous power 2 In this type of situation do not allow face and hands to come in contact with the capacitor or burns may be caused by the capacitors hi...

Страница 24: ... capacitors 1 1 The capacitor when used in the above unsuitable operating environments may deteriorate due to the corrosion of the terminations and the penetration of moisture into the capacitor 1 2 The same phenomenon as the above may occur when the electrodes or terminals of the capacitor are subject to moisture condensation 1 3 The deterioration of characteristics and insulation resistance due ...

Страница 25: ...ssibility of chip crack caused by PCB expansion contraction with heat Because stress for chip is different depend on PCB material and structure Especially metal PCB such as alumina has a greater risk of chip crack because of large difference of thermal expansion coefficient In case of chip below 0402 size there is also the same possibility of crack with a single layered glass epoxy board Pattern F...

Страница 26: ...ensions Part Number GR 02 0 4 0 2 0 16 0 2 0 12 0 18 0 2 0 23 GR 31 3 2 1 6 2 2 2 4 0 8 0 9 1 0 1 4 GR 32 3 2 2 5 2 0 2 4 1 0 1 2 1 8 2 3 GR 43 4 5 3 2 3 0 3 5 1 2 1 4 2 3 3 0 GR 55 5 7 5 0 4 0 4 6 1 4 1 6 3 5 4 8 in mm GR 21 0 6 0 8 2 0 1 25 1 0 1 2 0 9 1 0 0 8 1 1 GR 18 L W Dimensions Tolerance b GR 03 c Notice Chip L W a b c 0 8 0 9 0 6 0 8 0 6 0 7 0 6 0 8 GR 21 1 6 0 8 0 6 1 0 0 6 0 3 0 2 0 3 ...

Страница 27: ...trol curing temperature and time in order to prevent insufficient hardening 4 Flux Application 1 An excessive amount of flux generates a large quantity of flux gas which can cause a deterioration of Solderability So apply flux thinly and evenly throughout A foaming system is generally used for flow soldering 2 Flux containing too a high percentage of halide may cause corrosion of the outer electro...

Страница 28: ...sed as an under coating to buffer against the stress 2 Select a resin that is less hygroscopic Using hygroscopic resins under high humidity conditions may cause the deterioration of the insulation resistance of a capacitor An epoxy resin can be used as a less hygroscopic resin Others 1 Transportation 1 The performance of a capacitor may be affected by the conditions during transportation 1 1 The c...

Страница 29: ...ication 3 We consider it not appropriate to include any terms and conditions with regard to the business transaction in the product specifications drawings or other technical documents Therefore if your technical documents as above include such terms and conditions such as warranty clause product liability clause or intellectual property infringement liability clause they will be deemed to be inva...

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