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68P80400P86-O
6-1
CHAPTER 9
- MECHANICAL PARTS REWORK AND REPAIR
INTRODUCTION
The following section details the equipment and procedures needed to correctly remove and replace
specific Main Board components on the i850/i760.
Recommended Equipment
Hot Air Machine
Pace ThermoFlo 200 or similar.
Pre-heater
X-Kar 1000-S or similar.
High Performance Soldering Station
Pace HeatWise 200 with thermal recovery system or similar
Tip 1:
.6mm (0.06”) CHISEL (P/N1124-0019-P1) to fill lands (Big) during Land Preparation procedure.
Tip 2:
0.40mm (0.016”) 1/64” 60° BEVEL (P/N1124-0011-P1) to fill/level lands (Big) during Land
Preparation procedure.
Tip 3:
10.80mm (.425”) BLADE (P/N1124-0501-P1) to wick off or level solder (BGAs) during Land
Preparation procedure.
Microscope
Leica Stereozoom 6 or similar
Magnifier Lamp
5-diopter magnifier lamp.
Fume Absorber
Pace Arm-Evac 200 or similar.
Recommended Tools
Nozzles
Содержание i760
Страница 22: ...OVERVIEW SIM Cards 1 8 68P80400P94 O ...
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Страница 71: ...PREPARING FOR FIELD LEVEL TESTING Back Housing 68P80400P94 O 7 9 Figure 7 5 Figure 7 6 ...
Страница 76: ...PREPARING FOR FIELD LEVEL TESTING Exploded View and Parts List 7 14 68P80400P94 O 7 15 2 i850 Exploded View ...
Страница 78: ...PREPARING FOR FIELD LEVEL TESTING Exploded View and Parts List 7 16 68P80400P94 O 7 15 4 i760 Exploded View ...
Страница 96: ...FIELD LEVEL TEST MODES AND PROCEDURES MOTOtalk 8 18 68P80400P94 O This page intentionally left blank ...
Страница 99: ... Recommended Equipment 6 3 Audio jack Cover Dog House must be removed If present prior Rework or Baking ...