4
3.1 Handling Precautions
(1) Since the module case is made of resin, do not drop the module or apply a
strong impact to it.
(2) Do not remove the printed-circuit board of the module from the case.
Doing so will cause failure.
(3) Prevent foreign matter such as dust or wire chips from entering the module.
Failure to do so may cause a fire, failure, or malfunction.
(4) A protective film is attached to the module top to prevent foreign matter
such as wire chips from entering the module during wiring.
Do not remove the film during wiring.
Be sure to remove it for heat dissipation before system operation.
(5) Before handling the module, touch a grounded metal object to discharge
the static electricity from the human body.
Failure to do so may cause the module to fail or malfunction.
(6) Tighten the screws such as module fixing screws within the following
ranges.
Screw location
Tightening torque range
Module fixing screw (M3 screw)*1
0.36 to 0.48 N
y
m
Spring clamp terminal block fixing
screw (M4 screw)
0.78 to 1.18 N
y
m
*1: The module can be easily fixed onto the base unit using the hook at the top of
the module.
However, it is recommended to secure the module with the module fixing
screw if the module is subject to significant vibration.
