Microchip Technology PRO MATE II, Руководство пользователя

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1999 Microchip Technology Inc. DS30243H-page 9
PRO MATE
®
II DEVICE SUPPORT
Chapter 1. Socket Modules
1.1 Introduction
This chapter lists the part numbers for the socket modules that support
each device and discusses the life expectancy and cleaning procedures
for the different socket types. These sockets work on both PRO MATE and
PRO MATE II. For socket modules with two sets of screws, the longer screws
are for PRO MATE and the shorter screws are for PRO MATE II.
1.2 Highlights
The topics covered in this chapter are:
• Currently Supported Devices and Socket Modules
• Socket Life Expectancy and Cleaning Procedures
1.3 Currently Supported Devices and Socket
Modules
Table 1.1 defines the acronyms for the microcontroller device packages.
Table 1.2 lists the part numbers for the socket modules that support each
device.
Table: 1.1 Device Package Names
DIP Dual Inline Package PLCC Plastic Leaded Chip Carrier
SOIC Small Outline Integrated Circuit MQFP Metric Quad Flat Pack
SSOP Shrink Small Outline Package TQFP Thin Quad Flat Pack