2011-2015 Microchip Technology Inc.
DS40001609E-page 395
PIC16(L)F1508/9
Microchip Technology Drawing C04-255A Sheet 2 of 2
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
Number of Terminals
Overall Height
Terminal Width
Overall Width
Overall Length
Terminal Length
Exposed Pad Width
Exposed Pad Length
Terminal Thickness
Pitch
Standoff
Units
Dimension Limits
A1
A
b
D
E2
D2
A3
e
L
E
N
0.50 BSC
0.127 REF
2.60
2.60
0.30
0.20
0.45
0.00
0.25
4.00 BSC
0.40
2.70
2.70
0.50
0.02
4.00 BSC
MILLIMETERS
MIN
NOM
20
2.80
2.80
0.50
0.30
0.55
0.05
MAX
K
-
0.20
-
REF: Reference Dimension, usually without tolerance, for information purposes only.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
1.
2.
3.
Notes:
Pin 1 visual index feature may vary, but must be located within the hatched area.
Package is saw singulated
Dimensioning and tolerancing per ASME Y14.5M
Terminal-to-Exposed-Pad
20-Lead Ultra Thin Plastic Quad Flat, No Lead Package (GZ) - 4x4x0.5 mm Body [UQFN]
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