Microchip Technology MCP6S22 PGA PICtail, Руководство пользователя

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2004 Microchip Technology Inc. DS51327A-page iii
MCP6S2X Evaluation
Board (Rev.4) User’s Guide
Table of Contents
Preface ........................................................................................................1
Introduction................................................................................................ 1
About This Guide....................................................................................... 2
Recommended Reading............................................................................ 4
The Microchip Internet Web Site ............................................................... 4
Customer Support ..................................................................................... 5
Chapter 1. MCP6S2X Evaluation Board (Rev. 4)....................................7
1.1 Introduction ..................................................................................... 7
1.2 Evaluation Board Description ......................................................... 8
1.3 How it is used ................................................................................. 9
1.4 How it works ................................................................................. 10
Appendix A. Schematic and Board Layouts ....................................... 15
A.1 Introduction ................................................................................... 12
A.2 Schematic ................................................................................... 16
A.3 Top Silk Screen ........................................................................... 17
A.4 Top Metal Layer .......................................................................... 18
A.5 Ground Plane Layer .................................................................... 19
A.6 Power Plane Layer ...................................................................... 20
A.7 Bottom Metal Layer ..................................................................... 21
A.8 Bottom Silk Screen Layer (Top View) ......................................... 22
Appendix B. Bill of Materials (BOM) .................................................... 23
B.1 Introduction ................................................................................... 23
Appendix C. Evaluation Board Firmware ............................................ 25