Microchip Technology MCP6S22 PGA PICtail, Руководство пользователя

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MCP6S2X Evaluation
Board (Rev. 4) User’s Guide

2004 Microchip Technology Inc. DS51327B-page 15
Appendix A. Schematic and Board Layouts
A.1 INTRODUCTION
This appendix contains the schematic and printed circuit board (PCB) layout diagrams
for the MCP6S2X Evaluation Board (Rev. 4).
A.1.1 Highlights
The MCP6S2X Evaluation Board (Rev. 4) is constructed using a four-layer PCB. The
top and bottom layers are for components and traces. The second layer is the ground
plane and the third layer is (V
DD
) the power plane.
Diagrams included in this appendix include:
• Schematic
• Top Silk Screen Layer
• Top Metal Layer
• Ground Plane Layer
• Power Plane Layer
• Bottom Metal Layer
• Bottom Silk Screen Layer
Note: The bottom metal layer (A.7) is missing a connection between pin 8 of the
PIC16F676 (U2 in A.2) and pin 6 of the DIP switch (DSW1 in A.2) and with
the pull-down resistor (R11). These traces have been corrected prior to
shipping by making a solder bridge between these pins.