(Voltages referenced to GND.)
SDA, SCL, THM,
RST
, SYS, PFN1, PFN2,
MPC0, MPC1,
INT
, MON, BAT, LED,
L1IN, L2IN, L3IN
.............................................. -0.3V to +6.0V
B1LX, B2LX, B1OUT, B2OUT, EXT
...... -0.3V to (V
SYS
+ 0.3V)
L1OUT
................................................... -0.3V to (V
L1IN
+ 0.3V)
L2OUT ................................................... -0.3V to (V
L2IN
+ 0.3V)
L3OUT ................................................... -0.3V to (V
L3IN
+ 0.3V)
CHGIN .................................................................... -6V to +30V
CAP ................................... -0.3V to min (|V
CHGIN
| + 0.3V, +6V)
SET .......................................................... -0.3V to V
BAT
+ 0.3V
Continuous Current into CHGIN, BAT, SYS ................
±1000mA
Continuous Current into any other terminal ..................
±100mA
Continuous Power Dissipation (multilayer board at +70°C):
6 x 6 Array 36-Bump 2.72mm x 2.47mm
0.4mm Pitch WLP (derate 21.70mW/°C)
.......................
1.74W
Operating Temperature Range ........................... -40°C to +85°C
Junction Temperature ......................................................
+150°C
Storage Temperature Range ............................
-65°C to +150°C
Soldering Temperature (reflow) .......................................+260°C
PACKAGE TYPE: 36 WLP
Package Code
1
Outline Number
Land Pattern Number
Refer to
THERMAL RESISTANCE, FOUR-LAYER BOARD
Junction to Ambient (θ
JA
)
46°C/W
MAX20335
PMIC with Ultra-Low I
Q
Voltage Regulators and
Battery Chargers for Small Lithium Ion Systems
www.maximintegrated.com
Maxim Integrated
│
6
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board.
For detailed information on package thermal considerations, refer to
www.maximintegrated.com/thermal-tutorial
.
Absolute Maximum Ratings
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only; functional operation of the device at these or any
other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device
reliability.
For the latest package outline information and land patterns (footprints), go to
www.maximintegrated.com/packages
. Note that a “+”,
“#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing
pertains to the package regardless of RoHS status.
Package Information