V2.0 – Jan-13
User’s Manual
Page 27 of 41
7 Mounting
This chapter describes the suggested mounting process for the A2100-A receiver
modules. In a RoHS compliant product with a RoHS compliant process it is rec-
ommended to use chemical tin as the counter-part to the module’s pins. This will
guarantee highest resistance against shocks.
7.1 Proposed Footprint for Soldering
Following soldering footprint parameters are recommended:
•
Copper and solder paste footprint are identical
•
Pad-shape / -size, inner pads: 1.5 mm x 1.5 mm
•
Pad-shape / -size, outer pads: 1.762 mm x 0.8 mm
•
Stencil thickness of 120 – 150 µm
Figure 12: Recommended Solder PAD Layout