M2I MIO-LPG00, Руководство по оборудованию, Страница: 3 / 16

Industrial I/O Wireless Device Hardware Manual
M2I Corporation
11-35, Simin-daero 327beon-gil, Dongan-gu, Anyang-si, Gyeonggi-do 14055, Korea,
Tel: +82-70-465-3366, Fax: +82-31-465-3355,
www.m2i.co.kr
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Index
Chapter 1 Safety Precautions ............................................................................................................................................................................. 4
Chapter 2 Overview ................................................................................................................................................................................................ 6
2.1 Introduction ........................................................................................................................................................................ 6
2.2 Package Contents ............................................................................................................................................................ 6
2.3 Explanation of Model name ....................................................................................................................................... 6
Chapter 3 General Specification ....................................................................................................................................................................... 7
3.1 System Power Specifications ...................................................................................................................................... 7
3.2 Serial Communication Specifications ..................................................................................................................... 7
3.3 LoRa Communication Specifications....................................................................................................................... 7
3.4 Environment Specifications ......................................................................................................................................... 7
3.5 Structure Specifications ................................................................................................................................................ 7
Chapter 4 Part Names and General Specifications .................................................................................................................................. 8
4.1 Product Size ....................................................................................................................................................................... 8
4.2 Part Names and General Specifications ................................................................................................................ 8
Chapter 5 Operation and Settings .................................................................................................................................................................. 9
5.1 System Configuration .................................................................................................................................................... 9
5.2 Status LED ........................................................................................................................................................................... 9
5.3 Frequency Select and Communication Settings ............................................................................................. 10
5.4 RESET Button and MODE Button ........................................................................................................................... 11
Chapter 6 Interface ............................................................................................................................................................................................... 12
6.1 Wireless Communication Specifications ............................................................................................................. 12
6.2 Serial Communication Specifications ................................................................................................................... 12
Chapter 7 Installation and Wiring .................................................................................................................................................................. 13
7.1 Specifying Install Location ......................................................................................................................................... 13
7.2 DIN RAIL............................................................................................................................................................................. 13
7.3 Power, Ground, and Communication Cable Specification ......................................................................... 14
7.4 Cradle Ground Wiring ................................................................................................................................................. 14
Chapter 8 Maintenance ...................................................................................................................................................................................... 15
8.1 Case Cleaning .................................................................................................................................................................. 15
8.2 Periodic Check Points .................................................................................................................................................. 15
8.3 Problems with the Device .......................................................................................................................................... 15
Chapter 9 Products Label .................................................................................................................................................................................. 16