LT3081
27
3081fc
For more information
package DescripTion
Please refer to
http://www.linear.com/designtools/packaging/
for the most recent package drawings.
4.00 ±0.10
(4 SIDES)
NOTE:
1. PACKAGE OUTLINE DOES NOT CONFORM TO JEDEC MO-229
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
PIN 1
TOP MARK
(NOTE 6)
0.40 ±0.10
1
6
12
7
BOTTOM VIEW—EXPOSED PAD
2.65 ±0.10
0.75 ±0.05
R = 0.115
TYP
0.25 ±0.05
0.50 BSC
2.50 REF
3.38 ±0.10
0.200 REF
0.00 – 0.05
(DF12) DFN 1112 REV A
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
0.70 ±0.05
0.25 ±0.05
0.50 BSC
3.10 ±0.05
4.50 ±0.05
PACKAGE OUTLINE
PIN 1 NOTCH
R = 0.20 TYP OR
0.35
×
45°
CHAMFER
2.65 ±0.05
3.38 ±0.05
2.50 REF
DF Package
12-Lead Plastic DFN (4mm
×
4mm)
(Reference LTC DWG # 05-08-1733 Rev A)
