LT3081
28
3081fc
package DescripTion
Please refer to
http://www.linear.com/designtools/packaging/
for the most recent package drawings.
FE16 (BB) TSSOP REV K 0913
0.09 – 0.20
(.0035 – .0079)
0
°
– 8
°
0.25
REF
0.50 – 0.75
(.020 – .030)
4.30 – 4.50*
(.169 – .177)
1
3 4 5 6 7 8
10 9
4.90 – 5.10*
(.193 – .201)
16 1514 13 12 11
1.10
(.0433)
MAX
0.05 – 0.15
(.002 – .006)
0.65
(.0256)
BSC
2.94
(.116)
0.195 – 0.30
(.0077 – .0118)
TYP
2
RECOMMENDED SOLDER PAD LAYOUT
0.45
±
0.05
0.65 BSC
4.50
±
0.10
6.60
±
0.10
1.05
±
0.10
2.94
(.116)
3.05
(.120)
3.58
(.141)
3.58
(.141)
4.70
(.185)
MILLIMETERS
(INCHES)
NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS
2. DIMENSIONS ARE IN
3. DRAWING NOT TO SCALE
4. RECOMMENDED MINIMUM PCB METAL SIZE
FOR EXPOSED PAD ATTACHMENT
SEE NOTE 4
NOTE 5
NOTE 5
6.40
(.252)
BSC
FE Package
16-Lead Plastic TSSOP (4.4mm)
(Reference LTC DWG # 05-08-1663 Rev K)
Exposed Pad Variation BB
5. BOTTOM EXPOSED PADDLE MAY HAVE METAL PROTRUSION
IN THIS AREA. THIS REGION MUST BE FREE OF ANY EXPOSED
TRACES OR VIAS ON PBC LAYOUT
*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.150mm (.006") PER SIDE
DETAIL A
DETAIL A IS THE PART OF THE
LEAD FRAME FEATURE FOR
REFERENCE ONLY
NO MEASUREMENT PURPOSE
0.56
(.022)
REF
0.53
(.021)
REF
DETAIL A
