3. TECHNICAL BRIEF
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5.5.6 UMTS Duplexer(FL104:SAYZY1G95EB0B00)
A UMTS duplexer splits a single operating band into receive and transmit paths. Important
performance requirements include;
• Insertion loss . this component is also in the receive and transmit paths ; In the U970/KU970 typical
losses : UMTS2100_ Tx = 1.28 dB, UMTS2100_ Rx = 1.46 dB
• Out-of-band rejection or attenuation . the duplexer provides input selectivity for the receiver, output
filtering for the transmitter, and isolation between the two. Rejection levels for both paths are
specified over a number of frequency ranges. Two Tx-to-Rx isolation levels are critical to receiver
performance:
• Rx-band isolation . the transmitter is specified for out-of-band noise falling into the Rx band. This
noise leaks from the transmit path into the receive path, and must be limited to avoid degrading
receiver sensitivity. The required Rx-band isolation depends on the PA out of-band noise levels and
Rx-band losses between the PA and LNA. Minimum duplexer Rx band isolation value is about 46.7
dB.
• Tx-band isolation. the transmit channel power also leaks into the receiver. In this case, the leakage is
outside the receiver passband but at a relatively high level. It combines with Rx band jammers to
create cross-modulation products that fall in-band to desensitize the receiver. The required Tx-band
isolation depends on the PA channel power and Tx-band losses between the PA and LNA. Minimum
duplexer Tx-band isolation value is about 51.7dB.
• Passband ripple . the loss of this fairly narrowband device is not flat across its passband. Passband
ripple increases the receive or transmit insertion loss at specific frequencies, creating performance
variations across the band.s channels, and should be controlled.
• Return loss. minimize mismatch losses with typical return losses of 10 dB or more (VSWR <2:1).’
• Power handling . high power levels in the transmit path must be accommodated without degraded
performance. The specified level depends on the operating band class and mobile station class (per
the applicable standard), as well as circuit losses and antenna EIRP. Several duplexer characteristics
depend upon its source and load impedances.
QUALCOMM strongly recommends an isolator be used between the UMTS PA and duplexer to
assure proper performance.
Содержание U970
Страница 1: ...Date April 2007 Issue 1 0 Service Manual Model U970 KU970 Service Manual U970 KU970 ...
Страница 3: ... 4 ...
Страница 20: ...3 TECHNICAL BRIEF 21 Fig 1 2 RTR6275 RX feature ...
Страница 23: ...3 TECHNICAL BRIEF 24 Figure 1 4 RTR6275 IC functional block diagram WCDMA_2100_TX WCDMA_2100_RX ...
Страница 28: ...3 TECHNICAL BRIEF 29 Figure1 7 PM6650 Block Diagram ...
Страница 41: ...3 TECHNICAL BRIEF 42 Table 1 1 Summary of MSM6280 device features ...
Страница 45: ...3 TECHNICAL BRIEF 46 Figure 1 1 PM6650 Functional Block Diagram ...
Страница 76: ...4 TROUBLE SHOOTING 77 4 1 RF CRF Component TOP SIDE BOTTOM SIDE 4 TROUBLE SHOOTING ...
Страница 81: ...4 TROUBLE SHOOTING 82 Check C412 of PMIC U400 Check R214 of MSM U200 ...
Страница 83: ...4 TROUBLE SHOOTING 84 Logic Table of the FEM ...
Страница 89: ...4 TROUBLE SHOOTING 90 4 7 Checking GSM Block ...
Страница 91: ...4 7 3 Checking RF Tx level 4 TROUBLE SHOOTING 92 ...
Страница 94: ...4 TROUBLE SHOOTING 95 ...
Страница 100: ...4 TROUBLE SHOOTING 101 R403 Q402 Q401 Q400 Charging part Main PCB Front ...
Страница 103: ...4 TROUBLE SHOOTING 104 Q400 X 200 USB part 1 Main PCB Front U503 USB part 2 Main PCB Rear ...
Страница 112: ...4 TROUBLE SHOOTING 113 CN601 CN701 CN700 ...
Страница 115: ...4 TROUBLE SHOOTING 116 C500 C501 R501 R502 ...
Страница 117: ...4 TROUBLE SHOOTING 118 SPK Audio Amplifier Analog Switch ...
Страница 119: ...4 TROUBLE SHOOTING 120 MIC800 R507 C520 ...
Страница 121: ...4 TROUBLE SHOOTING 122 R303 Ear_Sense_N C210 MIC Input ...
Страница 141: ...5 DOWNLOAD 142 ...
Страница 147: ...5 DOWNLOAD 148 Read IMEI BT address from UE 2 Step 4 Check IMEI and Bluetooth address ...
Страница 158: ...6 BLOCK DIAGRAM 159 Table 2 1 RF Block Component ...
Страница 163: ...6 BLOCK DIAGRAM 164 6 2 4 Placement Top Side ...
Страница 164: ...6 BLOCK DIAGRAM 165 Bottom Side ...
Страница 165: ... 166 ...
Страница 175: ... 176 8 PCB LAYOUT U970 KU970 ...
Страница 176: ... 177 8 PCB LAYOUT U970 KU970 ...
Страница 177: ... 178 8 PCB LAYOUT U970 KU970 ...
Страница 178: ... 179 8 PCB LAYOUT U970 KU970 ...
Страница 179: ... 180 8 PCB LAYOUT ...
Страница 180: ... 181 8 PCB LAYOUT ...
Страница 181: ... 182 ...
Страница 187: ... 188 ...
Страница 189: ... 190 ...
Страница 209: ...Note ...
Страница 210: ...Note ...