2
INSTALLATION
32
OPTIFLEX X200
www.krohne.com
09/2018 - 4006564001 - AD IECEX OPTIFLEX x200 R01 en
Minimum limits for all EPLs
2.3.12 OPTIFLEX 8200 F (remote converter version)
SINGLE PTFE PROCESS SEAL SYSTEM
Maximum limits for EPL Ga/Gb, EPL Gb, EPL Da/Db and EPL Db
T2
T300
+250
+64
+59 [+62]
2
+280
+61
+54 [+58]
2
+300
+58 [+60]
2
+51 [+55]
2
T1
T315
+315
+56 [+58]
2
+49 [+53]
2
1
Values in parentheses are for Ex ic nA-approved devices with EPL Gc
2
If the device has a double ceramic process seal system, use the value in square brackets
INFORMATION!
If the device has an EPDM gasket, the maximum process connection temperature is +150
°
C. If
the device has an FKM/FPM gasket, the maximum process connection temperature is +200
°
C.
Min. process temperature or
process connection temperature
Maximum ambient temperature
[
°
C]
-40
-40
-50
-38
INFORMATION!
If the device has a Kalrez
®
gasket, minimum process connection temperature is -20
°
C. If the
device has an FKM/FPM gasket, minimum process connection temperature is -40
°
C. If the
device has a Metaglas
®
adaptor, minimum process connection temperature is -30
°
C.
Temperature
class
Maximum surface
temperature
Max. process
temperature or
process connection
temperature
Maximum ambient temperature
Aluminium housing
Stainless steel
housing
[
°
C]
T6
T85
+60
+50
+50
+85
+46
+46
T5
T100
+75
+65
+65
+100
+61
+61
T4
T135
+110
+80
+79
+135
+75
+74
Temperature
class
Maximum surface
temperature
Max.
process
temperature
or process
connection
temperature
Maximum ambient temperature
Aluminium housing
Stainless steel housing
4-20mA /
HART with
or without
optional
output
Fieldbus
(PA/FF)
Modbus RTU
4-20mA /
HART with
or without
optional
output
Fieldbus
(PA/FF)
Modbus RTU
[
°
C]