INSTALLATION
2
15
OPTIFLEX X200
www.krohne.com
09/2018 - 4006564001 - AD IECEX OPTIFLEX x200 R01 en
Maximum limits for EPL Gc and EPL Dc
Minimum limits for all EPLs
2.3.4 OPTIFLEX 6200 C (compact converter version)
Maximum limits for EPL Ga/Gb, EPL Gb, EPL Da/Db and EPL Db
Temperature
class
Maximum surface
temperature
Max.
process
temperature
or process
connection
temperature
Maximum ambient temperature
Aluminium housing
Stainless steel housing
4-20mA /
HART with
or without
optional
output
Fieldbus
(PA/FF)
Modbus RTU
4-20mA /
HART with
or without
optional
output
Fieldbus
(PA/FF)
Modbus RTU
[
°
C]
T6
T85
+60
+67 (+47)
1
+67
+67 (+47)
1
+67
+85
+67 (+47)
1
+67
+67 (+47)
1
+67
T5
T100
+75
+80 (+62)
1
+80
+80 (+62)
1
+80
+100
+79 (+62)
1
+79
+77 (+62)
1
+77
T4
T135
+110
+76
+71
+135
+67
+58
T3
T150
+150
+62
+50
1
Values in parentheses are for Ex ic nA-approved devices with EPL Gc
Min. process temperature or
process connection temperature
Maximum ambient temperature
Aluminium housing
Stainless steel
housing
[
°
C]
-40
-40
-40
-50
-36
-34
INFORMATION!
If the device has a Kalrez
®
gasket, minimum process connection temperature is -20
°
C. If the
device has an FKM/FPM gasket, minimum process connection temperature is -40
°
C.
Temperature
class
Maximum surface
temperature
Max.
process
temperature
or process
connection
temperature
Maximum ambient temperature
Aluminium housing
Stainless steel housing
4-20mA /
HART with
or without
optional
output
Fieldbus
(PA/FF)
Modbus RTU
4-20mA /
HART with
or without
optional
output
Fieldbus
(PA/FF)
Modbus RTU
[
°
C]
T6
T85
+60
+54
+50
+54
+50
+85
+52
+46
+52
+45