2
INSTALLATION
24
OPTIFLEX X200
www.krohne.com
09/2018 - 4006564001 - AD IECEX OPTIFLEX x200 R01 en
SINGLE CERAMIC PROCESS SEAL SYSTEM
Maximum limits for EPL Ga/Gb, EPL Gb, EPL Da/Db and EPL Db
Maximum limits for EPL Gc and EPL Dc
INFORMATION!
If the device has a Kalrez
®
gasket, minimum process connection temperature is -20
°
C. If the
device has an FKM/FPM gasket, minimum process connection temperature is -40
°
C. If the
device has a Metaglas
®
adaptor, minimum process connection temperature is -30
°
C.
Temperature
class
Maximum surface
temperature
Max. process
temperature or
process connection
temperature
Maximum ambient temperature
Aluminium housing
Stainless steel
housing
[
°
C]
T6
T85
+60
+50
+50
+85
+47
+47
T5
T100
+75
+65
+65
+100
+62
+62
T4
T135
+110
+80
+80
+135
+77
+75
T3
T200
+150
+74
+72
+180
+69
+67
+200
+66
+63
T2
T250
+250
+58
+54
Temperature
class
Maximum surface
temperature
Max.
process
temperature
or process
connection
temperature
Maximum ambient temperature
Aluminium housing
Stainless steel housing
4-20mA /
HART with
or without
optional
output
Fieldbus
(PA/FF)
Modbus RTU
4-20mA /
HART with
or without
optional
output
Fieldbus
(PA/FF)
Modbus RTU
[
°
C]
T6
T85
+60
+67 (+47)
1
+67
+67 (+47)
1
+67
+85
+67 (+47)
1
+67
+67 (+47)
1
+67
T5
T100
+75
+80 (+62)
1
+80
+80 (+62)
1
+80
+100
+80 (+62)
1
+80
+80 (+62)
1
+80
T4
T135
+110
+80
+80
+135
+77
+75
T3
T200
+150
+74
+72
+180
+69
+67
+200
+66
+63
T2
T250
+250
+58
+54
1
Values in parentheses are for Ex ic nA-approved devices with EPL Gc
