SMARC-sAMX7 User Guide. Rev. 1.9
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5/
Pin Definitions
5.1.
Processor Support
Kontron used a Freescale/NXP/Qualcomm’s i.MX7 chip with 28
nm die. There are Solo and Dual SKUs with
19
mm
x
19
mm BGA package in 0.75
mm pitch available.
Table 6: Processor Support
Name
Speed
RAM.
Cache
TDP/Tj
Solo CPU:
MCIMX7S5EVM08SC
0.8 GHz
1 GB
512 KB
2 W/-20°C to
105ºC
Dual CPU:
MCIMX7D5EVM10SC
1.0 GHz
2 GB
512 KB
4 W/-20°C
to 105ºC
5.2.
System Memory Support
The memory system has one DDR3L channel. The system supports the following memory features:
32-bit data bus width (4 devices x8 bit)
533 MHz (1066
MT/s) clock (data rate)
Table 7: DDR3L memory options
512MB
4x 1 Gbit density 128Mx8 DDR 3L parts
1 GByte
4x 2 GBit density 256Mx8 DDR3L parts
2 GByte
4x 4 GBit density 512Mx8 DDR3L parts
5.3.
eMMC Flash Memory
An optional embedded Multimedia Flash Card (eMMC) complying with the eMMC 5.0 specification can be
permanently attached to the module, allowing for a capacity of up to 64 GByte NAND Flash. During the COMe-cAL6’s
manufacturing process, Multi Level Cell (MLC) eMMC is reconfigured to act as a pseudo Single Level Cell (pSLC)
eMMC to provide improved reliability, endurance and performance.
Specific eMMC Flash memory features are:
Up to 64 GByte pSLC (or128 GB MLC)
eMMC 5.0 specification
Class 0 (basic); class 2 (block read); class 4 (block write); class 5 (erase); class 6 (write protection); class 7 (lock
card)
HS200/HS400 modes
DDR modes up to 52 MHz clock speed
ECC and block management
Boot operation (High-speed boot)
Sleep mode
Permanent and power-on write protection
Replay-protected memory block (RPMB)
Secure erase and secure trim
