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CP6016
Preface
ID 1022-3074, Rev. 2.0
Page vii
P R E L I M I N A R Y
5.1.1
CP6016 Baseboard ........................................................................ 5 - 3
5.1.2
Backplane ....................................................................................... 5 - 4
5.1.3
Power Supply Units ........................................................................ 5 - 4
5.1.3.1
Start-Up Requirement ............................................................ 5 - 4
5.1.3.2
Power-Up Sequence .............................................................. 5 - 4
5.1.3.3
Tolerance ................................................................................ 5 - 5
5.1.3.4
Regulation .............................................................................. 5 - 5
5.2
Power Consumption ................................................................................ 5 - 6
5.2.1
Power Consumption of the CP6016 Accessories ........................... 5 - 8
5.2.2
Power Consumption of the Gigabit Ethernet Controllers ................ 5 - 8
5.3
Start-Up Currents of the CP6016 ............................................................ 5 - 8
5.4
Power Available for PMC/XMC Devices ................................................. 5 - 9
6.
Thermal Considerations ......................................................... 6 - 3
6.1
Board Internal Thermal Monitoring .......................................................... 6 - 3
6.1.1
Placement of the Temperature Sensors ......................................... 6 - 3
6.2
Processor Thermal Monitoring and Regulation ....................................... 6 - 4
6.2.1
Digital Thermal Sensor (DTS) ......................................................... 6 - 4
6.2.2
Thermal Diode Sensor .................................................................... 6 - 4
6.2.3
Thermal Monitor 1 (TM1) ................................................................ 6 - 4
6.2.4
Thermal Monitor 2 (TM2) ................................................................ 6 - 5
6.2.5
TM1 and TM2 Operation ................................................................. 6 - 5
6.2.6
Catastrophic Cooling Failure Sensor .............................................. 6 - 5
6.3
Chipset Thermal Monitor ......................................................................... 6 - 6
6.4
External Thermal Regulation ................................................................... 6 - 6
6.4.1
Operational Limits for the CP6016 .................................................. 6 - 8
6.4.2
Peripherals ...................................................................................... 6 - 9
A.
CP6016-MK2.5-SATA Assembly Kit .......................................A - 3
A.1 CP6001-EXT-SATA Module Overview .....................................................A - 3
A.2 Technical Specifications ..........................................................................A - 3
A.3 CP6001-EXT-SATA Functional Block Diagram .......................................A - 4
A.4 CP6001-EXT-SATA Module Layout .........................................................A - 5
Содержание CP6016
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