<Module board>
(Lead free solder used in the board (material : Sn-Ag-Cu, melting point : 219 Centigrade))
(Lead free solder used in the board (material : Sn-Cu, melting point : 230 Centigrade))
1P1A
S1A
GND
B
B
A
GEA10288-
A
A
5:TRST
4:TDO
3:TCK
2:TMS
1:TDI
5
2 3
4
1
PbF
MARK
UL
C454
C455
C456
C457
R457
R456
R455
K448
K447
K446
K445
K444
K443
K442
RST
C498
C497
C49
6
R454
R453
R452
R451
C426
R450
R449
R448
R447
R446
R445
R444
L407
C605
C604
R431
R430
C471
C401
C402
C403
C404
R429
R242
R43
3
Q401
R434
L491
C495
C494
C492
C493
C491
IC49
1
R424
C410
R421
R422
R415
R420
R419
R41
8
L406
L405
L404
C421
C420
C419
L403
C416
C417
C415
C414
R407
R406
R402
L402
L401
R401
C409
C405
C406
R404
C408
C407
R405
X401
R443
R442
R441
C442
C441
K441
C443
IC441
C424
C423
C422
IC401
R521
R607
R606
R604
R605
L601
IC601
IC471
C601
C43
0
C429
C603
C602
CN44
4
C606
K451
created date:2010-03-17
No.MA475
(No.MA475<Rev.001>)17/21
Содержание KW-XG700J
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