4P1A
T1A
GEB10288A
R458
K450
K449
C453
C452
C451
R435
R609
CN442
CN441
R42
3
C425
IC402
R432
R428
R481
C482
C481
R427
R426
R425
D401
R408
C411
R409
R417
R416
R414
R413
R412
R411
R410
C418
R403
C448
C447
C446
C445
C444
C449
C450
IC442
IC481
R601
R603
R608
R602
D601
L410
C428
C427
CN44
4
L409
<Module board>
(Lead free solder used in the board (material : Sn-Ag-Cu, melting point : 219 Centigrade))
(Lead free solder used in the board (material : Sn-Cu, melting point : 230 Centigrade))
created date:2010-03-17
No.MA475
(No.MA475<Rev.001>)18/21
Содержание KW-XG700J
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