P2A
T2A
GEB10283A
2
R933
C939
R932
R931
R93
5
R936
R937
C935
PbF
MARK
UL
C936
C934
C938
C937
R938
<Sub board (for KD-S27J)>
(Lead free solder used in the board (material : Sn-Ag-Cu, melting point : 219 Centigrade))
(Lead free solder used in the board (material : Sn-Cu, melting point : 230 Centigrade))
created date:2010-08-05
No.MA465
(No.MA465<Rev.003>)33/37
Содержание KD-R35E
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