<Sub board (for KD-R35E,35EY,38EE,411E,411EY,411EU,412E,412EY,412EU,417EE)>
(Lead free solder used in the board (material : Sn-Ag-Cu, melting point : 219 Centigrade))
(Lead free solder used in the board (material : Sn-Cu, melting point : 230 Centigrade))
F1A
GEA10283A2
S1A
D930
L931
R934
C933
C940
C932
C931
IC930
C93
0
created date:2010-08-05
No.MA465
(No.MA465<Rev.003>)24/37
Содержание KD-R35E
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