<Sub board (for KD-S27J)>
(Lead free solder used in the board (material : Sn-Ag-Cu, melting point : 219 Centigrade))
(Lead free solder used in the board (material : Sn-Cu, melting point : 230 Centigrade))
F2A
S2A
GEA10283A2
D930
L931
R934
C933
C940
C932
C931
IC930
C930
created date:2010-08-05
No.MA465
(No.MA465<Rev.003>)32/37
Содержание KD-R35E
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