<DC-DC Sub board>
(Lead free solder used in the board (material : Sn-Ag-Cu, melting point : 219 Centigrade))
(Lead free solder used in the board (material : Sn-Cu, melting point : 230 Centigrade))
F1A
S1A
GEA10284A
3
D930
L931
R934
C933
C940
C932
C931
IC930
C930
created date:2010-02-09
No.MA467
(No.MA467<Rev.001>)16/21