4
LOSS OF BUSINESS, LOSS OF USE OF DATA, INTERRUPTION OF
BUSINESS AND THE LIKE).
PRODUCTS AND CORPORATE NAMES IN THIS MANUAL MAY OR MAY
NOT BE REGISTERED TRADEMARKS OR COPYRIGHTS OF THEIR
RESPECTIVE
OWNERS. THEY ARE USED ONLY FOR IDENTIFICATION OR EXPLANATION
AND TO THE OWNER'S BENEFIT, WITHOUT INTENT TO INFRINGE.
Item Checklist
5
B 860T Motherboard
5
Cable for IDE/Floppy
5
CD for motherboard utilities
5
B 860T User’s Manual
Intel
®
Processor Family
Thermal Solutions
As processor technology pushes to faster speed and higher performance,
thermal management becomes increasingly crucial to computer systems.
Maintaining the proper thermal environment is the key to reliable, long-term
system operation. The overall goal in providing the proper thermal environment is
keeping the processor's temperature below its specified maximum case temperature.
Heatsinks induce improved processor heat dissipation through increased surface
area and concentrated airflow from attached fans. In addition, interface materials
allow
effective transfers of heat from the processor to the heatsink. For optimum heat
transfer,
Intel recommends the use of thermal grease and mounting clips to attach the heatsink
to the processor. When selecting a thermal solution for your system, please refer to
the website below for collection of heatsinks evaluated and recommended by Intel.
Vendor list for heatsink and fan of Pentium® !!! processor, please visit:
http://developer.intel.com/design/Pentiumiii/components/index.htm
Vendor list for heatsink and fan of Intel® Celeron
TM
processor, please visit:
http://developer.intel.com/design/celeron/components/index.htm
