Intel Desktop Board D2700MUD, Спецификация

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Contents
1 Product Description
1.1 Overview ......................................................................................... 11
1.1.1 Feature Summary ................................................................. 11
1.1.2 Board Layout ........................................................................ 13
1.1.3 Block Diagram ...................................................................... 15
1.2 Online Support ................................................................................. 16
1.3 Processor ........................................................................................ 16
1.3.1 Intel
®
D2700 Graphics Subsystem ........................................... 17
1.4 System Memory ............................................................................... 18
1.5 Intel
®
NM10 Express Chipset .............................................................. 20
1.5.2 USB ..................................................................................... 22
1.5.3 SATA Support ....................................................................... 22
1.6 Real-Time Clock Subsystem ............................................................... 23
1.7 Legacy I/O Controller ........................................................................ 23
1.8 LAN Subsystem ................................................................................ 24
1.8.1 LAN Subsystem Drivers .......................................................... 24
1.8.2 RJ-45 LAN Connector with Integrated LEDs .............................. 25
1.9 Audio Subsystem .............................................................................. 26
1.9.1 Audio Subsystem Software ..................................................... 27
1.9.2 Audio Connectors and Headers ................................................ 27
1.10 Hardware Management Subsystem ..................................................... 28
1.10.1 Hardware Monitoring ............................................................. 28
1.10.2 Thermal Monitoring ............................................................... 29
1.11 Power Management .......................................................................... 30
1.11.1 ACPI .................................................................................... 30
1.11.2 Hardware Support ................................................................. 33
2 Technical Reference
2.1 Memory Map .................................................................................... 37
2.1.1 Addressable Memory ............................................................. 37
2.2 Connectors and Headers .................................................................... 40
2.2.1 Back Panel ........................................................................... 41
2.2.2 Component-side Connectors and Headers................................. 43
2.3 BIOS Configuration Jumper Block ....................................................... 55
2.4 Mechanical Considerations ................................................................. 57
2.4.1 Form Factor .......................................................................... 57
2.5 Electrical Considerations .................................................................... 58
2.5.1 Fan Header Current Capability ................................................ 58
2.5.2 Add-in Board Considerations ................................................... 58
2.6 Thermal Considerations ..................................................................... 58
2.6.1 Passive Heatsink Design in a Passive System Environment ......... 60