Intel® Core™ 2 Duo Mobile Processors on 45-nm process for Embedded Applications
June 2008
TDG
Order Number: 320028-001
20
Reference Thermal Solutions—Core™ 2 Duo Mobile Processors
6.4.1
Keep Out Zone Requirements
The keep out zone requirements on the PCB to use this heatsink are detailed in
Appendix B,
“Mechanical Drawings”
. Because it extends beyond the footprint of the device, it is critical for board
designers to allocate space for the heatsink.
6.4.2
Thermal Performance
The 1U reference heatsink employs a thick copper (C1100) base with aluminum (Al 1050) stamped
fins, soldered to the base. The heatsink has been tested at flow rates from 10 CFM to 25 CFM. For a
40 °C external ambient and 35 W TDP, the heatsink is expected to meet the thermal performance
needed when the air flow rate is greater than 10 CFM. If the external ambient is 55 °C, this heatsink
will be suitable if the air flow rate is approximately 12 CFM or greater.
Figure 8.
1U Reference Heatsink Assembly
