Core™ 2 Duo Mobile Processors—Reference Thermal Solutions
Intel® Core™ 2 Duo Mobile Processors on 45-nm process-Thermal Design Guide
TDG
June 2008
21
Order Number: 320028-001
6.5
Compact PCI Reference Heatsink
The cPCI reference thermal solution is shown in
Figure 10
. The maximum heatsink height is
constrained to 8.7 mm. The heatsink uses the fastener assembly (refer to
Section 6.6
) to mount to
the PCB. Detailed drawings of this heatsink are provided in
Appendix B, “Mechanical Drawings”
.
Figure 9.
1U Heatsink Thermal Performance vs. Volumetric Airflow Rate
Figure 10.
CompactPCI Reference Heatsink Assembly
1U+ Reference Heatsink Performance
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
0
5
10
15
20
25
30
Volum etric Air Flow Rate (CFM)
PSI
(
C
/W
)
Psi_ja
Psi_sa
