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Intel® Core™ 2 Duo Mobile Processors on 45-nm process for Embedded Applications

June 2008

TDG

Order Number: 320028-001

32

Mechanical Drawings—Core™ 2 Duo Mobile Processors

Figure 16.

AdvancedTCA* Reference Heatsink PCB Keep Out Zone Requirements (Sheet 2

of 2)

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Содержание CORE 2 DUO MOBILE - THERMAL DESIGN GUIDE 6-2008

Страница 1: ...Order Number 320028 001 Intel Core 2 Duo Mobile Processors on 45 nm process for Embedded Applications Thermal Design Guide June 2008...

Страница 2: ...g from future changes to them The Intel Core 2 Duo Mobile Processors on 45 nm process for Embedded Applications may contain design defects or errors known as errata which may cause the product to devi...

Страница 3: ...lution Characterization 15 5 1 1 Calculating the Required Thermal Performance for the Intel Core 2 Duo processor 16 6 0 Reference Thermal Solutions 18 6 1 ATCA Reference Thermal Solution 18 6 2 Keep O...

Страница 4: ...ction 23 13 Measuring TLA with an Active Heatsink 26 14 Measuring TLA with a Passive Heatsink 27 15 AdvancedTCA Reference Heatsink PCB Keep Out Zone Requirements Sheet 1 of 2 31 16 AdvancedTCA Referen...

Страница 5: ...bile Processors Tables Intel Core 2 Duo Mobile Processors on 45 nm process Thermal Design Guide TDG June 2008 5 Order Number 320028 001 Revision History Date Revision Description June 2008 1 0 First P...

Страница 6: ...sign guidelines for the Intel Core 2 Duo Mobile Processors on 45 nm process for Embedded Applications in the micro Flip Chip Pin Grid Array micro FCPGA package and the micro Flip Chip Ball Grid Array...

Страница 7: ...Junction to ambient thermal characterization parameter A measure of heatsink thermal performance using the total package power Defined as T JUNCTION TLA Total Package Power TIM Thermal interface mater...

Страница 8: ...l model user s guide to aid system designers in simulating analyzing and optimizing thermal solutions in an integrated system level environment The models are for use with commercially available Compu...

Страница 9: ...terials Doing so may short the capacitors and possibly damage the device or render it inactive The processor package has mechanical load limits that are specified in the processor datasheet These load...

Страница 10: ...mal solution is also minimal so Intel requires the use of a heatsink for all usage conditions 3 2 Maximum Allowed Component Temperature The device must maintain a maximum temperature at or below the v...

Страница 11: ...e TIM specified for thermal solutions mentioned later die pressure should not be lower than approximately 138 kPa 20 psi This will keep TIM resistance better than approximately 0 30 o C cm2 W 4 2 Pack...

Страница 12: ...45 nm process for Embedded Applications June 2008 TDG Order Number 320028 001 12 Mechanical Specifications Core 2 Duo Mobile Processors Notes 1 Dimension in millimeters inches Figure 2 Primary Side K...

Страница 13: ...ical Specifications Intel Core 2 Duo Mobile Processors on 45 nm process Thermal Design Guide TDG June 2008 13 Order Number 320028 001 Notes 1 Dimension in millimeters inches Figure 3 Primary Side Keep...

Страница 14: ...rs on 45 nm process for Embedded Applications June 2008 TDG Order Number 320028 001 14 Mechanical Specifications Core 2 Duo Mobile Processors Notes 1 Dimension in millimeters inches Figure 4 Secondary...

Страница 15: ...s dissipated through the package socket motherboard stack to the environment and should not be considered to be a means of thermal control The junction to local ambient thermal characterization parame...

Страница 16: ...sume TDP 35 W and TJUNCTION 105 C Local processor ambient temperature TA 40 C Using Equation 1 the maximum allowable resistance junction to ambient is calculated as To determine the required heatsink...

Страница 17: ...w rate Table 3 summarizes the thermal budget required to adequately cool the Intel Core 2 Duo Mobile Processors on 45 nm process Since the data is based on air data at sea level a correction factor wo...

Страница 18: ...the reference thermal solutions The heatsinks were tested as an assembly with a thermal test vehicle TTV TIM socket and test board The test assembly is placed in a rectangular duct with no upstream o...

Страница 19: ...n all copper C1100 design The performance of this heatsink has been tested at flow rates from 10 CFM to 30 CFM The heatsink is expected to meet the thermal performance needed when the air flow rate is...

Страница 20: ...ritical for board designers to allocate space for the heatsink 6 4 2 Thermal Performance The 1U reference heatsink employs a thick copper C1100 base with aluminum Al 1050 stamped fins soldered to the...

Страница 21: ...e maximum heatsink height is constrained to 8 7 mm The heatsink uses the fastener assembly refer to Section 6 6 to mount to the PCB Detailed drawings of this heatsink are provided in Appendix B Mechan...

Страница 22: ...h all of the keep out zone requirements described in this document and should not degrade the thermal performance of the reference heatsinks Finally the fastener assembly should be designed to meet th...

Страница 23: ...TIM could be replaced during standard maintenance cycles The reference thermal solution uses Shin Etsu G751 Alternative materials can be used at the user s discretion Regardless the entire heatsink a...

Страница 24: ...or datasheet for more information on the DTS The legacy on board thermal diode is not recommended for performing heatsink validation The thermal diode is suitable for long term trending data but is no...

Страница 25: ...eyond the edge of the thermal solution Typical distance from the motherboard to the barrier is 81 mm 3 2 in If a barrier is used the thermocouple can be taped directly to the barrier with clear tape a...

Страница 26: ...ile Processors on 45 nm process for Embedded Applications June 2008 TDG Order Number 320028 001 26 Thermal Metrology Core 2 Duo Mobile Processors Note Drawing not to scale Figure 13 Measuring TLA with...

Страница 27: ...Processors Thermal Metrology Intel Core 2 Duo Mobile Processors on 45 nm process Thermal Design Guide TDG June 2008 27 Order Number 320028 001 Note Drawing not to scale Figure 14 Measuring TLA with a...

Страница 28: ...ability Requirements Test1 Requirement Pass Fail Criteria2 Mechanical Shock 50 g board level 11 msec 3 shocks axis Visual Check and Electrical Functional Test Random Vibration 7 3 g board level 45 min...

Страница 29: ...nctionality or compatibility of these devices This list and or these devices may be subject to change without notice Note The enabled components may not be currently available from all suppliers Conta...

Страница 30: ...sink PCB Keep Out Zone Requirements Sheet 2 of 2 Figure 16 AdvancedTCA Reference Heatsink Assembly Figure 17 AdvancedTCA Reference Heatsink Figure 18 CompactPCI Reference Heatsink PCB Keep Out Zone Re...

Страница 31: ...sors Mechanical Drawings Intel Core 2 Duo Mobile Processors on 45 nm process Thermal Design Guide TDG June 2008 31 Order Number 320028 001 Figure 15 AdvancedTCA Reference Heatsink PCB Keep Out Zone Re...

Страница 32: ...ocessors on 45 nm process for Embedded Applications June 2008 TDG Order Number 320028 001 32 Mechanical Drawings Core 2 Duo Mobile Processors Figure 16 AdvancedTCA Reference Heatsink PCB Keep Out Zone...

Страница 33: ...Duo Mobile Processors Mechanical Drawings Intel Core 2 Duo Mobile Processors on 45 nm process Thermal Design Guide TDG June 2008 33 Order Number 320028 001 Figure 17 AdvancedTCA Reference Heatsink As...

Страница 34: ...l Core 2 Duo Mobile Processors on 45 nm process for Embedded Applications June 2008 TDG Order Number 320028 001 34 Mechanical Drawings Core 2 Duo Mobile Processors Figure 18 AdvancedTCA Reference Heat...

Страница 35: ...ssors Mechanical Drawings Intel Core 2 Duo Mobile Processors on 45 nm process Thermal Design Guide TDG June 2008 35 Order Number 320028 001 Figure 19 CompactPCI Reference Heatsink PCB Keep Out Zone Re...

Страница 36: ...ocessors on 45 nm process for Embedded Applications June 2008 TDG Order Number 320028 001 36 Mechanical Drawings Core 2 Duo Mobile Processors Figure 20 CompactPCI Reference Heatsink PCB Keep Out Zone...

Страница 37: ...Duo Mobile Processors Mechanical Drawings Intel Core 2 Duo Mobile Processors on 45 nm process Thermal Design Guide TDG June 2008 37 Order Number 320028 001 Figure 21 CompactPCI Reference Heatsink Ass...

Страница 38: ...l Core 2 Duo Mobile Processors on 45 nm process for Embedded Applications June 2008 TDG Order Number 320028 001 38 Mechanical Drawings Core 2 Duo Mobile Processors Figure 22 CompactPCI Reference Heats...

Страница 39: ...Processors Mechanical Drawings Intel Core 2 Duo Mobile Processors on 45 nm process Thermal Design Guide TDG June 2008 39 Order Number 320028 001 Figure 23 1U Reference Heatsink PCB Keep Out Requireme...

Страница 40: ...bile Processors on 45 nm process for Embedded Applications June 2008 TDG Order Number 320028 001 40 Mechanical Drawings Core 2 Duo Mobile Processors Figure 24 1U Reference Heatsink PCB Keep Out Requir...

Страница 41: ...re 2 Duo Mobile Processors Mechanical Drawings Intel Core 2 Duo Mobile Processors on 45 nm process Thermal Design Guide TDG June 2008 41 Order Number 320028 001 Figure 25 1U Reference Heatsink Assembl...

Страница 42: ...Intel Core 2 Duo Mobile Processors on 45 nm process for Embedded Applications June 2008 TDG Order Number 320028 001 42 Mechanical Drawings Core 2 Duo Mobile Processors Figure 26 1U Reference Heatsink...

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