Intel® Core™ 2 Duo Mobile Processors on 45-nm process for Embedded Applications
June 2008
TDG
Order Number: 320028-001
10
Thermal Specifications—Core™ 2 Duo Mobile Processors
3.0
Thermal Specifications
3.1
Thermal Design Power
The Thermal Design Power (TDP) specification is listed in
Table 2
. Heat transfer through the micro-
FCBGA, micro-FCPGA package and socket via the base board is negligible. The cooling capacity
without a thermal solution is also minimal, so Intel requires the use of a heatsink for all usage
conditions.
3.2
Maximum Allowed Component Temperature
The device must maintain a maximum temperature at or below the value specified in
Table 2
. The
thermal solution is required to meet the temperatures specification while dissipating the Thermal
Design Power.
=
Table 2.
Thermal Specifications for the Intel
®
Core™2 Duo processor
CPU
Processor SKU#
TDP (W)
T
J-MAX
(°C)
T
J-MIN
(°C)
Intel® Core™ 2 Duo
Mobile Processors
on 45-nm process
Standard Voltage (Core 2 Duo-6M, Celeron-2M)
35
105
0
Low Voltage (Core 2 Duo -3M)
17
Ultra Low Voltage (Core 2 Duo -2M, Celeron)
10
