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Intel BX80616I3540 Скачать руководство пользователя страница 48

Thermal Solution Quality and Reliability Requirements

48

Thermal/Mechanical Design Guide

7.2.2

Post-Test Pass Criteria

The post-test pass criteria are:

1. No significant physical damage to the heatsink and retention hardware.
2. Heatsink remains seated and its bottom remains mated flatly against the IHS

surface. No visible gap between the heatsink base and processor IHS. No visible tilt
of the heatsink with respect to the retention hardware.

3. No signs of physical damage on baseboard surface due to impact of heatsink.
4. No visible physical damage to the processor package.
5. Successful BIOS/Processor/memory test of post-test samples.
6. Thermal compliance testing to demonstrate that the case temperature specification

can be met.

7.2.3

Recommended BIOS/Processor/Memory Test Procedures

This test is to ensure proper operation of the product before and after environmental
stresses, with the thermal mechanical enabling components assembled. The test shall
be conducted on a fully operational baseboard that has not been exposed to any
battery of tests prior to the test being considered.

Testing setup should include the following components, properly assembled and/or
connected:

• Appropriate system baseboard.
• Processor and memory.
• All enabling components, including socket and thermal solution parts.

The pass criterion is that the system under test shall successfully complete the
checking of BIOS, basic processor functions and memory, without any errors.

Intel PC

Diags

is an example of software that can be utilized for this test.

7.3

Material and Recycling Requirements

Material shall be resistant to fungal growth. Examples of non-resistant materials
include cellulose materials, animal and vegetable based adhesives, grease, oils, and
many hydrocarbons. Synthetic materials, such as PVC formulations, certain
polyurethane compositions (e.g., polyester and some polyethers), plastics which
contain organic fillers of laminating materials, paints, and varnishes also are
susceptible to fungal growth. If materials are not fungal growth resistant, then MIL-
STD-810E, Method 508.4 must be performed to determine material performance.

Material used shall not have deformation or degradation in a temperature life test.

Any plastic component exceeding 25 grams should be recyclable per the European Blue
Angel recycling standards.

The following definitions apply to the use of the terms lead-free, Pb-free, and RoHS
compliant.

Lead-free and Pb-free:

Lead has not been intentionally added, but lead may still

exist as an impurity below 1000 ppm.

RoHS compliant:

Lead and other materials banned in RoHS Directive are either

(1) below all applicable substance thresholds as proposed by the EU or (2) an
approved/pending exemption applies.

Note:

RoHS implementation details are not fully defined and may change.

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Содержание BX80616I3540

Страница 1: ...Document Number 321461 001 Intel Xeon Processor 3500 Series Thermal Mechanical Design Guide March 2009...

Страница 2: ...s to specifications and product descriptions at any time without notice Designers must not rely on the absence or characteristics of any features or instructions marked reserved or undefined Intel res...

Страница 3: ...cket Stackup Height 23 4 3 Socket Maximum Temperature 23 4 4 Loading Specifications 24 4 5 Electrical Requirements 24 4 6 Environmental Requirements 25 5 Sensor Based Thermal Specification Design Guid...

Страница 4: ...therboard 14 2 5 Pick and Place Cover 15 2 6 Package Installation Removal Features 16 2 7 LGA1366 NCTF Solder Joints 18 3 1 ILM Cover Assembly 20 3 2 ILM Assembly 21 3 3 Pin1 and ILM Lever 22 4 1 Flow...

Страница 5: ...ocket Mechanical Drawing Sheet 4 of 4 69 D 1 Processor Installation Tool 72 Tables 1 1 Reference Documents 8 1 2 Terms and Descriptions 8 4 1 Socket Component Mass 23 4 2 1366 land Package and LGA1366...

Страница 6: ...6 Thermal and Mechanical Design Guide Revision History Revision Number Description Revision Date 001 Initial release March 2009...

Страница 7: ...components described in this document include The processor thermal solution heatsink and associated retention hardware The LGA1366 socket and the Independent Loading Mechanism ILM and back plate The...

Страница 8: ...ent of the chipset that provides I O connections to PCIe drives and other peripherals LGA1366 socket The processor mates with the system board through this surface mount 1366 contact socket PECI The P...

Страница 9: ...power level TIM Thermal Interface Material The thermally conductive compound between the heatsink and the processor case This material fills the air gaps and voids and enhances the transfer of the he...

Страница 10: ...Introduction 10 Thermal Mechanical Design Guide...

Страница 11: ...on the motherboard The socket has 1366 contacts with 1 016 mm X 1 016 mm pitch X by Y in a 43x41 grid array with 21x17 grid depopulation in the center of the array and selective depopulation elsewher...

Страница 12: ...7 5 32 30 28 26 24 22 20 18 16 14 12 10 8 6 4 BA AY AW AV AU AT AR AP AN AM AL AK AJ AH AG AF AE AD AC AB AA Y W V U T R P N M L K J H G F E D C B A BA AY AW AV AU AT AR AP AN AM AL AK AJ AH AG AF AE...

Страница 13: ...Socket Land Pattern Top View of Board A C E G J L N R U W AA AC AE AG AJ AL AN AR AU AW BA B D F H K M P T V Y AB AD AF AH AK AM AP AT AV AY 1 3 7 5 9 11 15 13 17 19 23 21 25 27 31 29 1 3 7 5 9 11 15...

Страница 14: ...cal reflow rework The socket coefficient of thermal expansion in the XY plane and creep properties must be such that the integrity of the socket is maintained for the conditions listed in Chapter 7 Th...

Страница 15: ...event contamination during reflow The cover can withstand 260 C for 40 seconds typical reflow rework profile and the conditions listed in Chapter 7 without degrading As indicated in Figure 2 5 the cov...

Страница 16: ...ough alignment of package to socket The socket has alignment walls at the four corners to provide final alignment of the package See Appendix D for information regarding a tool designed to provide mec...

Страница 17: ...or 40 seconds typical reflow rework profile without degrading and must be visible after the socket is mounted on the motherboard LGA1366 and the manufacturer s insignia are molded or laser marked on t...

Страница 18: ...e overall product functionality Figure 2 7 identifies the NCTF solder joints Figure 2 7 LGA1366 NCTF Solder Joints A C E G J L N R U W AA AC AE AG AJ AL AN AR AU AW BA B D F H K M P T V Y AB AD AF AH...

Страница 19: ...ies and may not incorporate critical design parameters 3 1 Design Concept The ILM consists of two assemblies that will be procured as a set from the enabled vendors These two components are ILM cover...

Страница 20: ...apacitors An insulator is pre applied 3 2 Assembly of ILM to a Motherboard The ILM design allows a bottoms up assembly of the components to the board In step 1 see Figure 3 2 the back plate is placed...

Страница 21: ...uide 21 Independent Loading Mechanism ILM Figure 3 2 ILM Assembly Socket Body with Back Plate on board Socket Body Reflowed on board Step 1 Step 2 Socket Body with Back Plate on board Socket Body Refl...

Страница 22: ...icated in Figure 3 3 socket protrusion and ILM key features prevent 180 degree rotation of ILM cover assembly with respect to the socket The result is a specific Pin 1 orientation with respect to the...

Страница 23: ...to the top of the IHS and accounting for its nominal variation and tolerances that are given in the corresponding processor datasheet 2 This value is a RSS calculation 4 3 Socket Maximum Temperature T...

Страница 24: ...superimposed on the static load requirement 6 Test condition used a heatsink mass of 550 gm 1 21 lb with 50 g acceleration measured at heatsink mass The dynamic portion of this specification in the pr...

Страница 25: ...nductance L NA The inductance on a contact due to any single neighboring contact Maximum mutual capacitance C 1 pF The capacitance between two contacts Socket Average Contact Resistance EOL 15 2 m The...

Страница 26: ...reliability pdf Figure 4 1 Flow Chart of Knowledge Based Reliability Evaluation Methodology Establish the market expected use environment for the technology Develop Speculative stress conditions based...

Страница 27: ...Digital Thermal Sensor DTS for real time thermal specification compliance Single point of reference for thermal specification compliance over all operating conditions Does not required measuring proce...

Страница 28: ...TV Thermal Profile For the sensor based specification the only reference made to a case temperature measurement is on the TTV Functional thermal validation will not require the user to apply a thermoc...

Страница 29: ...specification is provided as a reference in Table 5 1 of Section 5 6 The fan speed control algorithm has enough information using only the DTS value and TAMBIENT to command the thermal solution to pr...

Страница 30: ...cket mechanical specifications and chassis environmental test limits the designer can make informed thermal solution design decisions The thermal boundary conditions for an ATX tower system are as fol...

Страница 31: ...TCC Note If an ambient of greater than 43 2 C is necessary based on the boundary conditions a thermal solution with a CA lower than 0 19 C W will be required 5 3 2 Thermal Design and Modelling Based...

Страница 32: ...oustic impact of the processor thermal solution in the system The characterization data should be taken over the operating range of the fan Using the RCHF5 as the example the fan is operational from 6...

Страница 33: ...MBIENT information and a FSC system that is provided data on the current TAMBIENT Either method will result in a thermally compliant solution and some acoustic benefit by operating the processor close...

Страница 34: ...20 Reference processor thermal solution RCFH5 Below TCONTROL the fan speed is slowed down as in prior products For a processor specification based on a TCASE thermal profile when the DTS value is equa...

Страница 35: ...or specification based on a TCASE thermal profile when the DTS value is equal to or greater than TCONTROL the fan speed is accelerated to maximum fan speed for the TAMBIENT as controlled by the thermi...

Страница 36: ...s TCC activity by instrumenting the PROCHOT signal from the processor TCC activation in functional application testing is unlikely with a compliant thermal solution Some very high power applications m...

Страница 37: ...curve was fit to the data in the form Psi_ca 1 a RPM b c RPM where a 0 000762 b 0 667637 c 004402 Table 5 1 Thermal Solution Performance above TCONTROL TAMBIENT 1 CA at DTS TCONTROL 2 RPM for CA at D...

Страница 38: ...Sensor Based Thermal Specification Design Guidance 38 Thermal Mechanical Design Guide...

Страница 39: ...H heatsink at a 30 angle from the processor thermal solution see the Intel X58 Express Chipset Thermal and Mechanical Design Guide for more details Table 6 1 summarizes the boundary conditions for des...

Страница 40: ...the RCBFH3 and RCFH4 The clip design is new to span the larger size of the LGA1366 The thermal solution assembly requires no assembly prior to installation on a motherboard Figure 6 1 shows the refere...

Страница 41: ...is compliant with the motherboard primary side height constraints defined in the ATX Specification and the microATX Motherboard Interface Specification found at http www formfactors org The reference...

Страница 42: ...ign Components 6 4 1 Extrusion The aluminum extrusion is a 51 fin 102 mm diameter bifurcated fin design The overall height of the extrusion is 38 mm tall To facilitate reuse of the core design the cen...

Страница 43: ...ial as used in previous clip designs The target metal clip nominal stiffness is 376 N mm 2150 lb in The combined target for reference clip and fasteners nominal stiffness is 260 N mm 1489 lb in The no...

Страница 44: ...CBF5 Reference Design can be used by other 3rd party cooling solutions The attach mechanism consists of A metal attach clip that interfaces with the heatsink core see Figure B 11 and Figure B 12 for t...

Страница 45: ...e Clip Core shoulder traps clip in place Core shoulder traps clip in place Clip Core Fin Array Fan Clip See Detail A Core Fin Array Fan Clip See Detail A Detail A Fin Array Clip Core 1 6 mm Detail A F...

Страница 46: ...re Intel does not test any third party software that reports absolute processor temperature As such Intel cannot recommend the use of software that claims this capability Since there is part to part v...

Страница 47: ...only Notes 1 It is recommended that the above tests be performed on a sample size of at least ten assemblies from multiple lots of material 2 Additional pass fail criteria may be added at the discret...

Страница 48: ...ion parts The pass criterion is that the system under test shall successfully complete the checking of BIOS basic processor functions and memory without any errors Intel PC Diags is an example of soft...

Страница 49: ...nt availability Table A 1 Reference Heatsink Enabled Components Item Intel PN AVC Delta Nidec ITW Heatsink Assembly RCBF5 Core Fan Extrusion TIM D95135 005 Z1ML005001 N A N A N A Heatsink Assembly DBX...

Страница 50: ...Component Suppliers 50 Thermal Mechanical Design Guide...

Страница 51: ...y Side Bottom Figure B 2 Socket Processor ILM Keepout Zone Primary Side Top Figure B 3 Socket Processor ILM Keepout Zone Secondary Side Bottom Figure B 4 Reference Design Heatsink Assembly 1 of 2 Figu...

Страница 52: ...TO 1 97 ADDED NOTE 7 02 23 09 T BYQUIST D82245 1 04 DWG NO SHT REV DEPARTMENTR 2200 MISSION COLLEGE BLVD P O BOX 58119 SANTA CLARA CA 95052 8119 TITLE LGA 1366 SOCKET B ATX KEEP INS SIZE DRAWING NUMB...

Страница 53: ...CONFIDENCE AND ITS CONTENTS MAY NOT BE DISCLOSED REPRODUCED DISPLAYED OR MODIFIED WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION D82245 2 04 DWG NO SHT REV DEPARTMENT R 2200 MISSION COLLEGE B...

Страница 54: ...Mechanical Drawings 54 Thermal Mechanical Design Guide Figure B 3 Socket Processor ILM Keepout Zone Primary Side Top...

Страница 55: ...Thermal Mechanical Design Guide 55 Mechanical Drawings Figure B 4 Socket Processor ILM Keepout Zone Secondary Side Bottom...

Страница 56: ...Mechanical Drawings 56 Thermal Mechanical Design Guide Figure B 5 Reference Design Heatsink Assembly 1 of 2...

Страница 57: ...Thermal Mechanical Design Guide 57 Mechanical Drawings Figure B 6 Reference Design Heatsink Assembly 2 of 2...

Страница 58: ...Mechanical Drawings 58 Thermal Mechanical Design Guide Figure B 7 Reference Fastener Sheet 1 of 4...

Страница 59: ...Thermal Mechanical Design Guide 59 Mechanical Drawings Figure B 8 Reference Fastener Sheet 2 of 4...

Страница 60: ...Mechanical Drawings 60 Thermal Mechanical Design Guide Figure B 9 Reference Fastener Sheet 3 of 4...

Страница 61: ...Thermal Mechanical Design Guide 61 Mechanical Drawings Figure B 10 Reference Fastener Sheet 4 of 4...

Страница 62: ...TAMPED D94152 002 TOP 0 5 019 A B 0 5 019 A B D D SQ 53 5 0 2 2 11 00 4X 10 0 2 394 007 105 94 4 171 105 94 4 171 2 0 2 079 007 3 34 0 2 132 007 45 19 1 779 B 7 36 44 0 2 1 435 007 A 7 7 NOTES 1 THIS...

Страница 63: ...ORATION SHEET 2 OF 2 DO NOT SCALE DRAWING SCALE 1 TMD 01 D94152 X D REV DRAWING NUMBER CAGE CODE SIZE DEPARTMENT D94152 2 01 DWG NO SHT REV 0 1 003 A B 0 2 007 A B 0 4 015 A B 0 5 019 A B 1 65 0650 45...

Страница 64: ...Mechanical Drawings 64 Thermal Mechanical Design Guide...

Страница 65: ...echanical drawings included in this appendix Table C 1 Mechanical Drawing List Drawing Description Figure Number Socket Mechanical Drawing Sheet 1 of 4 Figure C 1 Socket Mechanical Drawing Sheet 2 of...

Страница 66: ...Socket Mechanical Drawings 66 Thermal Mechanical Design Guide Figure C 1 Socket Mechanical Drawing Sheet 1 of 4...

Страница 67: ...Thermal Mechanical Design Guide 67 Socket Mechanical Drawings Figure C 2 Socket Mechanical Drawing Sheet 2 of 4...

Страница 68: ...Socket Mechanical Drawings 68 Thermal Mechanical Design Guide Figure C 3 Socket Mechanical Drawing Sheet 3 of 4...

Страница 69: ...Thermal Mechanical Design Guide 69 Socket Mechanical Drawings Figure C 4 Socket Mechanical Drawing Sheet 4 of 4...

Страница 70: ...Socket Mechanical Drawings 70 Thermal Mechanical Design Guide...

Страница 71: ...ation Tool D Processor Installation Tool The following optional tool is designed to provide mechanical assistance during processor installation and removal Contact the supplier for availability Billy...

Страница 72: ...Processor Installation Tool 72 Thermal Mechanical Design Guide Figure D 1 Processor Installation Tool...

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