Thermal/Mechanical Design Guide
47
Thermal Solution Quality and Reliability Requirements
7
Thermal Solution Quality and
Reliability Requirements
7.1
Reference Heatsink Thermal Verification
Each motherboard, heatsink and attach combination may vary the mechanical loading
of the component. Based on the end user environment, the user should define the
appropriate reliability test criteria and carefully evaluate the completed assembly prior
to use in high volume. The Intel reference thermal solution will be evaluated to the
boundary conditions in
Table 7-1
.
The test results, for a number of samples, are reported in terms of a worst-case mean
+ 3
σ
value for thermal characterization parameter using real processors (based on the
TTV correction offset).
7.2
Mechanical Environmental Testing
The Intel reference heatsinks will be tested in an assembled condition, along with the
LGA1366. Details of the Environmental Requirements, and associated stress tests, can
be found in
Table 7-1
are based on speculative use condition assumptions, and are
provided as examples only.
Notes:
1.
It is recommended that the above tests be performed on a sample size of at least ten assemblies from
multiple lots of material.
2.
Additional pass/fail criteria may be added at the discretion of the user.
7.2.1
Recommended Test Sequence
Each test sequence should start with components (i.e., baseboard, heatsink assembly,
etc.) that have not been previously submitted to any reliability testing.
Prior to the mechanical shock & vibration test, the units under test should be
preconditioned for 72 hours at 45 ºC. The purpose is to account for load relaxation
during burn-in stage.
The test sequence should always start with a visual inspection after assembly, and
BIOS/Processor/memory test. The stress test should be then followed by a visual
inspection and then BIOS/Processor/memory test.
Table 7-1.
Use Conditions (Board Level)
Test
(1)
Requirement
Pass/Fail Criteria
(2)
Mechanical Shock
3 drops each for + and - directions in each of 3
perpendicular axes (i.e., total 18 drops)
Profile: 50 g, Trapezoidal waveform,
4.3 m/s [170 in/s] minimum velocity change
Visual Check and Electrical
Functional Test
Random Vibration
Duration: 10 min./axis, 3 axes
Frequency Range: 5 Hz to 500 Hz
Power Spectral Density (PSD) Profile: 3.13 g RMS
Visual Check and Electrical
Functional Test
Содержание BX80616I3540
Страница 1: ...Document Number 321461 001 Intel Xeon Processor 3500 Series Thermal Mechanical Design Guide March 2009...
Страница 10: ...Introduction 10 Thermal Mechanical Design Guide...
Страница 38: ...Sensor Based Thermal Specification Design Guidance 38 Thermal Mechanical Design Guide...
Страница 50: ...Component Suppliers 50 Thermal Mechanical Design Guide...
Страница 56: ...Mechanical Drawings 56 Thermal Mechanical Design Guide Figure B 5 Reference Design Heatsink Assembly 1 of 2...
Страница 57: ...Thermal Mechanical Design Guide 57 Mechanical Drawings Figure B 6 Reference Design Heatsink Assembly 2 of 2...
Страница 58: ...Mechanical Drawings 58 Thermal Mechanical Design Guide Figure B 7 Reference Fastener Sheet 1 of 4...
Страница 59: ...Thermal Mechanical Design Guide 59 Mechanical Drawings Figure B 8 Reference Fastener Sheet 2 of 4...
Страница 60: ...Mechanical Drawings 60 Thermal Mechanical Design Guide Figure B 9 Reference Fastener Sheet 3 of 4...
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Страница 66: ...Socket Mechanical Drawings 66 Thermal Mechanical Design Guide Figure C 1 Socket Mechanical Drawing Sheet 1 of 4...
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Страница 68: ...Socket Mechanical Drawings 68 Thermal Mechanical Design Guide Figure C 3 Socket Mechanical Drawing Sheet 3 of 4...
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