Thermal/Mechanical Design Guide
17
LGA1366 Socket
2.5
Durability
The socket must withstand 30 cycles of processor insertion and removal. The max
chain contact resistance from
Table 4-4
must be met when mated in the 1st and 30th
cycles.
The socket Pick and Place cover must withstand 15 cycles of insertion and removal.
2.6
Markings
There are three markings on the socket:
• LGA1366: Font type is Helvetica Bold - minimum 6 point (2.125 mm).
• Manufacturer's insignia (font size at supplier's discretion).
• Lot identification code (allows traceability of manufacturing date and location).
All markings must withstand 260 °C for 40 seconds (typical reflow/rework profile)
without degrading, and must be visible after the socket is mounted on the
motherboard.
LGA1366 and the manufacturer's insignia are molded or laser marked on the side wall.
2.7
Component Insertion Forces
Any actuation must meet or exceed SEMI S8-95 Safety Guidelines for Ergonomics/
Human Factors Engineering of Semiconductor Manufacturing Equipment, example Table
R2-7 (Maximum Grip Forces). The socket must be designed so that it requires no force
to insert the package into the socket.
2.8
Socket Size
Socket information needed for motherboard design is given in
Appendix C
.
This information should be used in conjunction with the reference motherboard keep-
out drawings provided in
Appendix B
to ensure compatibility with the reference thermal
mechanical components.
Содержание BX80616I3540
Страница 1: ...Document Number 321461 001 Intel Xeon Processor 3500 Series Thermal Mechanical Design Guide March 2009...
Страница 10: ...Introduction 10 Thermal Mechanical Design Guide...
Страница 38: ...Sensor Based Thermal Specification Design Guidance 38 Thermal Mechanical Design Guide...
Страница 50: ...Component Suppliers 50 Thermal Mechanical Design Guide...
Страница 56: ...Mechanical Drawings 56 Thermal Mechanical Design Guide Figure B 5 Reference Design Heatsink Assembly 1 of 2...
Страница 57: ...Thermal Mechanical Design Guide 57 Mechanical Drawings Figure B 6 Reference Design Heatsink Assembly 2 of 2...
Страница 58: ...Mechanical Drawings 58 Thermal Mechanical Design Guide Figure B 7 Reference Fastener Sheet 1 of 4...
Страница 59: ...Thermal Mechanical Design Guide 59 Mechanical Drawings Figure B 8 Reference Fastener Sheet 2 of 4...
Страница 60: ...Mechanical Drawings 60 Thermal Mechanical Design Guide Figure B 9 Reference Fastener Sheet 3 of 4...
Страница 61: ...Thermal Mechanical Design Guide 61 Mechanical Drawings Figure B 10 Reference Fastener Sheet 4 of 4...
Страница 64: ...Mechanical Drawings 64 Thermal Mechanical Design Guide...
Страница 66: ...Socket Mechanical Drawings 66 Thermal Mechanical Design Guide Figure C 1 Socket Mechanical Drawing Sheet 1 of 4...
Страница 67: ...Thermal Mechanical Design Guide 67 Socket Mechanical Drawings Figure C 2 Socket Mechanical Drawing Sheet 2 of 4...
Страница 68: ...Socket Mechanical Drawings 68 Thermal Mechanical Design Guide Figure C 3 Socket Mechanical Drawing Sheet 3 of 4...
Страница 69: ...Thermal Mechanical Design Guide 69 Socket Mechanical Drawings Figure C 4 Socket Mechanical Drawing Sheet 4 of 4...
Страница 70: ...Socket Mechanical Drawings 70 Thermal Mechanical Design Guide...
Страница 72: ...Processor Installation Tool 72 Thermal Mechanical Design Guide Figure D 1 Processor Installation Tool...