Sensor Based Thermal Specification Design Guidance
36
Thermal/Mechanical Design Guide
5.5
System Validation
System validation should focus on ensuring the fan speed control algorithm is
responding appropriately to the DTS values and T
AMBIENT
data as well as any other
device being monitored for thermal compliance.
Since the processor thermal solution has already been validated using the TTV to the
thermal specifications at the predicted T
AMBIENT
, additional TTV based testing in the
chassis is not expected to be necessary.
Once the heatsink has been demonstrated to meet the TTV Thermal Profile, it should be
evaluated on a functional system at the boundary conditions.
In the system under test and Power/Thermal Utility Software set to dissipate the TDP
workload confirm the following item:
• Verify if there is TCC activity by instrumenting the PROCHOT# signal from the
processor. TCC activation in functional application testing is unlikely with a
compliant thermal solution. Some very high power applications might activate TCC
for short intervals this is normal.
• Verify fan speed response is within expectations - actual RPM (
Ψ
CA
) is consistent
with DTS temperature and T
AMBIENT
.
• Verify RPM vs. PWM command (or voltage) output from the FSC device is within
expectations.
• Perform sensitivity analysis to asses impact on processor thermal solution
performance and acoustics for the following:
— Other fans in the system.
— Other thermal loads in the system.
In the same system under test, run real applications that are representative of the
expected end user usage model and verify the following:
• TCC activation is not occurring.
• Verify fan speed response vs. expectations as done using Power/Thermal Utility
SW.
• Validate system boundary condition assumptions: Trise, venting locations, other
thermal loads and adjust models / design as required.
Содержание BX80616I3540
Страница 1: ...Document Number 321461 001 Intel Xeon Processor 3500 Series Thermal Mechanical Design Guide March 2009...
Страница 10: ...Introduction 10 Thermal Mechanical Design Guide...
Страница 38: ...Sensor Based Thermal Specification Design Guidance 38 Thermal Mechanical Design Guide...
Страница 50: ...Component Suppliers 50 Thermal Mechanical Design Guide...
Страница 56: ...Mechanical Drawings 56 Thermal Mechanical Design Guide Figure B 5 Reference Design Heatsink Assembly 1 of 2...
Страница 57: ...Thermal Mechanical Design Guide 57 Mechanical Drawings Figure B 6 Reference Design Heatsink Assembly 2 of 2...
Страница 58: ...Mechanical Drawings 58 Thermal Mechanical Design Guide Figure B 7 Reference Fastener Sheet 1 of 4...
Страница 59: ...Thermal Mechanical Design Guide 59 Mechanical Drawings Figure B 8 Reference Fastener Sheet 2 of 4...
Страница 60: ...Mechanical Drawings 60 Thermal Mechanical Design Guide Figure B 9 Reference Fastener Sheet 3 of 4...
Страница 61: ...Thermal Mechanical Design Guide 61 Mechanical Drawings Figure B 10 Reference Fastener Sheet 4 of 4...
Страница 64: ...Mechanical Drawings 64 Thermal Mechanical Design Guide...
Страница 66: ...Socket Mechanical Drawings 66 Thermal Mechanical Design Guide Figure C 1 Socket Mechanical Drawing Sheet 1 of 4...
Страница 67: ...Thermal Mechanical Design Guide 67 Socket Mechanical Drawings Figure C 2 Socket Mechanical Drawing Sheet 2 of 4...
Страница 68: ...Socket Mechanical Drawings 68 Thermal Mechanical Design Guide Figure C 3 Socket Mechanical Drawing Sheet 3 of 4...
Страница 69: ...Thermal Mechanical Design Guide 69 Socket Mechanical Drawings Figure C 4 Socket Mechanical Drawing Sheet 4 of 4...
Страница 70: ...Socket Mechanical Drawings 70 Thermal Mechanical Design Guide...
Страница 72: ...Processor Installation Tool 72 Thermal Mechanical Design Guide Figure D 1 Processor Installation Tool...
